The attached file is on T-stress of an interfacial crack in a bi-material strip. The geometry of the problem is the same with that of Suo and Hutchinson (1990, IJF). Using a conservation integral technique, a formula for T-stress is derived with two numerical factors.
An approximate predictive model is developed for the evaluation of the interfacial thermal stresses in a soldered bi-material assembly with a low-yield-stress bonding material. This material is considered linearly elastic at the strain level below the yield point and ideally plastic at the higher strains. The results of the analysis can be used for the assessment of the thermally induced stresses
Smart materials have received much attention in recent years, especially due to their various applications in smart structures, medical devices, actuators, space and aeronautics. Among these
materials, shape memory alloys exhibit extremely large, inelastic, recoverable strains (of the order of 10%), resulting from transformation between austenitic and martensitic phases. This
transformation may be induced by a change, either in the applied stress, the temperature, or both.
Arteries are living organs that can remodel themself in response to stress changes. Arterial remodeling is a big topic and this paper shows only a tip of the iceberg.
We present a surface Cauchy-Born approach to modeling FCC metals with nanometer scale dimensions for which surface stresses contribute significantly to the overall mechanical response. The model is based on an extension of the traditional Cauchy-Born theory in which a surface energy term that is obtained from the underlying crystal structure and governing interatomic potential is used to augment the bulk energy.
Dear Prof. Li, i have made two figures about rupture strains of films on elastomer according to the datas shown in your papers-- "Deformability of thin metal films on elastomer substrates" International Journal of Solids and Structures 43 (2006) 2351–2363. and "Stretchability of thin metal films on elastomer substrates" APL85(2004). According to the papers, the stiffer or thicker the elastomer substrates, the larger rupture strains, then where would be the curve with H/h =200? Whether the rupture strain is even large, according to your simulations?
Cross-posted to Biocurious a blog about biology through the eyes of physicists.
Dear Wei and Mogadalai,
As mentioned earlier I am trying to solve for a vector {x} from
{x'}=[A(t)]{x}
where [A(t)] is known matrix of size (2X2) at the max 4x4, elements and are functions of "t".
{x} is a vector (nX1) function of 't'
{x'} is derivative of {x} with respect to 't'.
I just came across the lecture notes from Professor Nix on Mechanical Properties of Thin Films. It is very educative and helpful. I wonder if anyone could recommend some analytical derivation on the stress of the adhesive layer between two similar/dissimilar adherends (sandwiched specimen) under mechanical or thermal loading.
Many thanks ...
