finite element analysis
Postdoctoral
Image-Based Simulation Workshop
WORKSHOP: Image-based Simulation for Biomechanics, Materials Applications, and Reverse Engineering
This workshop is aimed at those interested in 3D reconstruction from radiology images, and in using 3D image data (as obtained from CT, Micro-CT, MRI and Ultrasound) to generate Rapid Prototyping, CAD, and Finite Element models.
Participants will learn:
• how to generate computer models from your 3D image data
• how to import and position CAD files in the image data
Looking for postdoctoral position: FEM, ferroelectrics, MEMS, computational electromagnetics.
I am looking for a postdoctoral position. I have expeience in finite element modeling and laboratory measurements of ultrasonic waves in ferroelectric and piezoelectric plates, piezoelectric transducers and actuators, MEMs. Also worked in the field of computational electromagnetics. Please look at the attached resume.
Materialise & Simulia Medical Engineering Seminar
Materialise and Dassault Systemes Simulia Benelux are pleased to announce their co-organized Medical Engineering Seminar which will take place on 4 October 2011, at the Materialise HQ in Leuven, Belgium. The Medical Engineering Seminar is a meeting for and by users and aims to bring together biomechanical engineers currently working, or interested in patient-realistic finite element modeling.
Graduate and Postdoc Research Positions in Cardiovascular Mechanics
These positions have been filled.
Packaging Mechanical Engineer at Hopewell Junction, NY, IBM Microelectronics Division
Packaging mechanical engineers conduct simulation of electronic packages
to optimize package design for compatibility with assembly processes
and for reliable operation in end user systems such as servers, game
consoles and network switches. Simulation is conducted using commercial
finite element software such as ANSYS or ABAQUS to predict package
component stresses and strains. Simulations are verified by measurements
of warpage and stresses / strains in the packages using Digital image
contrast, strain gages, capacitance meters, etc. Package material
properties such as coefficient of thermal expansion, Poisson ratio and
modulus that are required for simulation are measured using specialized
mechanical equipment. Thus, familiarity with numerical simulation
ansys viscoelastic model
Hi
The Finite Element Analysis of Shells - Fundamentals - Second Edition (Springer, 2011)
Dominique Chapelle and Klaus-Jürgen Bathe
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