Nonlinear mechanics of single-atomic-layer graphene sheets
Qiang Lu and Rui Huang
Department of Aerospace Engineering and Engineering mechanics, University of Texas, Austin,
TX 78712, USA
R. Huang Group Research
A review on Chip-Package Interaction and Its Impact on Reliability of Cu/low k Interconnects
X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.
Abstract:
Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films
H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).
Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.
Fabrication and Characterization of Patterned Single-Crystal Silicon Nanolines
B. Li, M. K. Kang, K. Lu, R. Huang, P. S. Ho, R. A. Allen, and M. W. Cresswell, Nano Letters 8, 92 -98 (2008). (Web Release Date: 07-Dec-2007; DOI: 10.1021/nl072144i)
Fracture, Delamination, and Buckling of Elastic Thin Films on Compliant Substrates
Attached slides were presented at the 2007 ASME Congress at Seattle.
Internal lattice relaxation of single-layer graphene under in-plane deformation
This paper has been published in Journal of the Mechanics and Physics of Solids 56 (2008), pp. 1609-1623 (doi:10.1016/j.jmps.2007.07.013).
Abstract
Thin films: wrinkling vs buckle-delamination
H. Mei, J.Y. Chung, H.-H. Yu, C.M. Stafford, and R. Huang, Buckling modes of elastic thin films on elastic substrates. Applied Physics Letters 90, 151902 (2007).
Two modes of thin film buckling are commonly observed, one with interface delamination (e.g., telephone cord blisters) and the other with no delamination (i.e., wrinkling). Which one would occur for your film?