If you are a master student and would like
to do your master thesis, there is an opportunity to do it at Bosch in
Stuttgart, Germany. The grant will be given for 6 months and can be extended to
6 more months ( 6 months internship plus six months master thesis.)
For more information regarding the grant and
the position please see below job description or contact me.
Regards,
Hossein
Job description:
The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.
X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.
Abstract:
H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).
Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.
