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flexible electronics

Hangbo Zhao's picture

Ph.D. positions in flexible electronics at University of Southern California

We have several Ph.D. positions available in our group ( in Aerospace and Mechanical Engineering and Biomedical Engineering at University of Southern California for Fall 2023. We are an interdesciplinary group with broad interests in flexible and stretchable sensors, experimental mechanics, advanced materials, and micro/nano manufacturing. Our focus areas include 3D soft electronics, brain-machine interfaces, unconventional micro/nano fabrication, and engineered surfaces/interfaces.

Xiaoyue Ni's picture

Multiple Positions on Robotic Metamaterials and Flexible Electronics at Duke University

My lab is looking for strongly motivated Ph.D. students and Postdocs to join our group in the Department of Mechanical Engineering & Materials Science at Duke University. We conduct research on human-centered materials intelligence through a combination of flexible electronics, robotic metamaterials, and artificial intelligence. Two positions are available immediately. 


Position 1: The project will focus on the design, fabrication, and testing of robotic mechanical metamaterials.

Xueju Sophie Wang's picture

Postdoc position in flexible electronic sensors at the University of Connecticut

One postdoc position is available in Wang Research lab ( in the Department of Materials Science and Engineering (MSE) and the Institute of Materials Science (IMS) at the University of Connecticut (UConn).

Xiaoyue Ni's picture

Multiple positions on flexible electronics and programmable metamaterials at Duke University

We are looking for strongly motivated Postdocs and/or Ph.D. students to join our group in the Department of Mechanical Engineering & Materials Science at Duke University. Two openings with primary focuses on flexible electronics and programmable matter are available immediately. 


Xin Ning's picture

Postdoc Position in Flexible Electronics

POST-DOCTORAL SCHOLAR, PENN STATE:  The Advanced Structures Laboratory, Department of Aerospace Engineering at the Pennsylvania State University, University Park Campus invites applications for an appointment as a Postdoctoral Scholar.


Postdoc Position - Flexible Electronics - University of Pittsburgh

The Shankar Research Group at the University of Pittsburgh anticipates an opening for a postdoctoral associate starting March 2019. The position’s primary area of research will focus on design and integration of flexible electronics with responsive polymers. A background in microfabrication and design of electromechanical systems is preferred.

dithoap's picture

2 POSTDOC posts on Computational Solid Mechanics (Delamination modeling) and Functional Nanocomposites/Wearable Electronics

The Division of Physical Sciences and Engineering at King Abdullah University of Science and
Technology (KAUST), Saudi Arabia, invites applications for Postdoctoral fellow in Mechanical
Engineering at the Composite and Heterogeneous Material Analysis and Simulation Laboratory

2 field of studies are available:

Matt Pharr's picture

Lab-on-Skin: A Review of Flexible and Stretchable Electronics for Wearable Health Monitoring

Skin is the largest organ of the human body, and it offers a diagnostic interface rich with vital biological signals from the inner organs, blood vessels, muscles, and dermis/epidermis. Soft, flexible, and stretchable electronic devices provide a novel platform to interface with soft tissues for robotic feedback and control, regenerative medicine, and continuous health monitoring.

Nanshu Lu's picture

Call For Abstracts: 2016 SES Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics

Dear colleagues,

You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.

mortezaamjadi's picture

Computational analysis of metallic nanowire-elastomer nanocomposite based strain sensors

Possessing a strong piezoresistivity, nanocomposites of metal nanowires and elastomer have been studied extensively for its use in highly flexible, stretchable, and sensitive sensors. In this work, we analyze the working mechanism and performance of a nanocomposite based stretchable strain sensor by calculating the conductivity of the nanowire percolation network as a function of strain. We reveal that the nonlinear piezoresistivity is attributed to the topological change of percolation network, which leads to a bottleneck in the electric path.

mortezaamjadi's picture

Ultra-stretchable and skin-mountable strain sensors using carbon nanotubes–Ecoflex nanocomposites

Super-stretchable, skin-mountable, and ultra-soft strain sensors are presented by using carbon nanotube percolation networksilicone rubber nanocomposite thin films. The applicability of the
strain sensors as epidermal electronic systems, in which mechanical compliance like human skin and high stretchability (e > 100%) are required, has been explored. The sensitivity of the strain

Nanshu Lu's picture

Call for papers: Soft Robotics - a new journal dedicated to soft machines

Dear colleagues and friends, 


On behalf of the editorial board, I would like to introduce our new Journal, Soft Robotics (SoRo) to the mechanics community. SoRo is an innovative peer-reviewed journal dedicated to the science and engineering of soft materials in mobile machines. The Journal breaks new ground as the first to answer the urgent need for research on robotic technology that can safely interact with living systems and function in complex natural or human-built environments.

Jianliang Xiao's picture

A Conformal, Bio-Interfaced Class of Silicon Electronics for Mapping Cardiac Electrophysiology

In this paper recently feature on the cover of Science Translational Medicine, we report the development of a class of mechanically flexible silicon electronics for multiplexed measurement of signals in an intimate, conformal integrated mode on the dynamic, three-dimensional surfaces of soft tissues in the human body. Mechanics model shows that the strain in the fragile materials, e.g. silicon, is several orders of magnitude smaller than the fracture strain, when wrapped onto the curvilinear cardiac surface.

Teng Li's picture

Symposium on Materials and Devices for Flexible and Stretchable Electronics at 2009 MRS Spring Meeting

Call for papers

2009 MRS Spring Meeting, San Francisco, CA, April 13-17

Symposium PP: Materials and Devices for Flexible and Stretchable Electronics

Abstract Deadline: 3 November 2008

Theoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates

In this paper, we report comprehensive experimental and theoretical
studies of bending in structures relevant to inorganic flexible electronics.
Different from previous mechanics models of related systems, our analysis does not
assume the thin film to cover the entire substrate, thereby explicitly
accounting for effects of edges and finite device sizes, both of which play
critically important roles in the mechanics and bending properties. These
thin-film islands give nonuniform stress, with maxima that often appear at the
edges and spatially non-uniform shear and normal stresses along the film/substrate
interface. Although these results are generally applicable to all classes of

Rui Huang's picture

Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films

H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).

Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.

Nanshu Lu's picture

Co-evolution of local thinning and debonding

A 1um-thick Cu film was deposited on Kapton 50HN substrate, with a thin Cr interlayer to improve adhesion. The specimen was in-situ annealed at 200oC for 30min after deposition.

This FIB image was taken after the specimen was uniaxially stretched to 50% and released.


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