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suo group research

Critical Size of Stiff Islands on Stretchable Substrates due to Interface Delamination

Submitted by Nanshu Lu on

One possible design of stretchable integrated circuits consists of functional islands of stiff thin films on a polymer substrate. When such a structure is stretched, the substrate carries most of the deformation while the islands experience little strain. However, in practice, the island/substrate interface can never cohere perfectly. Existing experiments suggest that, interface debonding occurs if the island is larger than a certain size. I am now studying the critical size of stiff islands on stretchable polymer substrates due to thin film delamination, using finite element simulations. We show that the maximum energy release rate of interfacial cracking goes down as island size or substrate stiffness decreases. As a result, the critical island size can be enhanced if the substrate is chosen to be more compliant. An approximate formula is given to predict the energy release rate for the configuration of stiff islands on very compliant substrate.

Interplay between elastic interactions and kinetic processes in stepped Si (001) homoepitaxy

Submitted by Wei Hong on

A vicinal Si (001) surface may form stripes of terraces, separated by monatomic-layer-high steps of two kinds, SA and SB. As adatoms diffuse on the terraces and attach to or detach from the steps, the steps move. In equilibrium, the steps are equally spaced due to elastic interaction. During deposition, however, SA is less mobile than SB. We model the interplay between the elastic and kinetic effects that drives step motion, and show that during homoepitaxy all the steps may move in a steady state, such that alternating terraces have time-independent, but unequal, widths. The ratio between the widths of neighboring terraces is tunable by the deposition flux and substrate temperature. We study the stability of the steady state mode of growth using both linear perturbation analysis and numerical simulations. We elucidate the delicate roles played by the standard Ehrlich-Schwoebel (ES) barriers and inverse ES barriers in influencing growth stability in the complex system containing (SA+SB) step pairs.

Preprint available in the attachment.

Split singularities and the competition between crack penetration and debond at a bimaterial interface

Submitted by Zhen Zhang on

Zhen Zhang and Zhigang Suo

For a crack impinging upon a bimaterial interface at an angle, the singular stress field is a linear superposition of two modes, usually of unequal exponents, either a pair of complex conjugates, or two unequal real numbers. In the latter case, a stronger and a weaker singularity coexist (known as split singularities). We define a dimensionless parameter, called the local mode mixity, to characterize the proportion of the two modes at the length scale where the processes of fracture occur. We show that the weaker singularity can readily affect whether the crack will penetrate, or debond, the interface.