Submit your abstract for the 2019 Society of Engineering Science meeting on the campus of Washington University in St. Louis (WashU), October 13-15, 2019, deadline April 30, 2019 Information about tracks and symposia: https://ses2019.wustl.edu/track-symposia/
Submit your abstract: https://ses2019.wustl.edu/track-symposia/abstracts/
Dear all,
I bring your attention to the following workshop that will be held in Rome on November 18-20, 2019.
Attendance of the workshop is free. All the relevant information are available in the attached flyer.
Workshop RAM3, Recent Advances in Mechanics and Mathematics of Materials — 2nd International Meeting of Young Researchers
We are running workshops in Shanghai and Wuhan this May - join us to learn about going from 3D imaging to CAD, CAE, and 3D printing.
Learn more and register:
* Shanghai - Friday May 10th, 2019
* Wuhan - Tuesday May 14th, 2019
Abstract submission for the Society of Engineering Science annual conference is now open:
https://ses2019.wustl.edu/track-symposia/abstracts/
The deadline to submit is April 30th, 2019. Please consider subitting to our symposium on the Mechanics and Physics of Soft Materials. A full description is given below.
Colleagues:
The technical meeting of the Society of Engineering Science (SES) will be held at Washington University in St. Louis on October 13-15, 2019. As part of this meeting we are organizing Symposium 7.4 on “Mechanics of Electrochemically Active Materials”. The deadline for abstract submission is April 30
Date / Time: Wednesday, May 15, 2019 / 1:30 pm - 4:30 pm
Location: Synopsys Denmark, Vester Farimagsgade 3, Copenhagen, Denmark
Fee: Free-to-attend. Pre-registration is required as places are limited
Who Should Attend
Dear colleague,
the abstract submission deadline for
CIVIL-COMP 2019
The Sixteenth International Conference on Civil, Structural and Environmental Engineering Computing
16-19 September 2019 Riva Del Garda Congress Centre, Lake Garda, Italy
http://www.civil-compconf.com/
is extended to 6th May 2019.
Dear Colleagues,
Please consider submitting your abstract to our mini-symposium on "Mechanics of deformable atomically-thin materials (Symposium 8.2)" at the 56th Annual Technical Meeting of the Society of Engineering Science (SES), Washington University in St. Louis, October 13-15, 2019.
We encourage you to contribute an abstract to the symposium "Multiscale mechanics of granular media" (Symposium 6.2) at the 56th Annual Technical Meeting of the Society of Engineering Science (SES) to be held on the campus of Washington University in St. Louis, October 13-15, 2019. The symposium description may be found below. For further details and to submit an abstract, please see the meeting website.
The abstract submission deadline is April 30, 2019.
It would be great to see you there!
The 55th Meeting of the Society for Natural Philosophy: Microstructure, defects, and growth in mechanics
September 13-15, 2019, Loyola University Chicago
