We are running workshops in Shanghai and Wuhan this May - join us to learn about going from 3D imaging to CAD, CAE, and 3D printing.
Learn more and register:
* Shanghai - Friday May 10th, 2019
* Wuhan - Tuesday May 14th, 2019
Dear colleagues,
We would like to draw your attention to the following minisymposium at the Third International Conference on Damage Mechanics (ICDM3) to be held in Shanghai, China, July 4-6th, 2018:
MS5: Computational modeling of damage and failure in solids and structures
organised by Jian-Ying Wu (South China University of Technology), Phu Nguyen (Monash University) and Zhenjun Yang (Zhejiang University). The topics are:
