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A (001) surface of silicon consists of terraces of two variants, which have an identical atomic structure, except for a 90° rotation. We formulate a model to evolve the terraces under the combined action of electric current and applied strain. The electric current motivates adatoms to diffuse by a wind force, while the applied strain motivates adatoms to diffuse by changing the concentration of adatoms in equilibrium with each step. To promote one variant of terraces over the other, the wind force acts on the anisotropy in diffusivity, and the applied strain acts on the anisotropy in surface stress. Our model reproduces experimental observations of stationary states, in which the relative width of the two variants becomes independent of time. Our model also predicts a new instability, in which a small change in experimental variables (e.g., the applied strain and the electric current) may cause a large change in the relative width of the two variants.

Xi Wang, Yves Bellouard, Joost J. Vlassak

Published in Acta Materialia 53 (2005) p4955-4961.

Abstract — We present the results of a crystallization study on NiTi shape memory thin films in which amorphous films are annealed by a scanning laser. This technique has the advantage that shape memory properties can be spatially distributed as required by the application. A kinetics study shows that nucleation of the crystalline phase occurs homogenously in the films. Consequently, the laser annealing process produces polycrystalline films with a random crystallographic texture. The crystallized films have a uniform microstructure across the annealed areas. The material in the crystalline regions transforms reversibly to martensite on cooling from elevated temperature and stress measurements show that a significant recovery stress is achieved in the films upon transformation.

Cells function based on a complex set of interactions that control pathways resulting in ultimate cell fates including proliferation, differentiation, and apoptosis. The interworkings of his immensely dense network of intracellular molecules are influenced by more than random protein and nucleic acid distribution where their interactions culminate in distinct cellular function.

Low dielectric constant (low-k) is achieved often at the cost of degraded mechanical properties, making it difficult to integrate the dielectric in the back end of line (BEOL) and to package low-k chips. Development of low-k technology becomes costly and time-consuming. Therefore, more frequently than before, people resort to modeling to understand mechanical issues and avoid failures. In this paper we present three multilevel patterned film models to examine channel cracking in low-k BEOL. The effects of copper features, caps and multilevel interconnects are investigated and their implications to BEOL fabrication are discussed.

Low-k BEOL Mechanical Modeling
Liu, Xiao Hu; Lane, Michael W; Shaw, Thomas M; Liniger, Eric G; Rosenberg, Robert R; Edelstein, Daniel C
Advanced Metallization Conference 2004 (AMC 2004); San Diego, CA and Tokyo; USa and Japan; 19-21 Oct. 2004 and 28-29 Sept. 2004. pp. 361-367. 2005

DEPARTMENT OF MECHANICAL ENGINEERING AND MATERIALS SCIENCE

PRATT SCHOOL OF ENGINEERING

The Department of Mechanical Engineering and Materials Science invites applications for tenure-track faculty positions. Two tenure-track appointments are anticipated and are open to all ranks, Assistant, Associate and Full Professor level. Applications are invited from candidates with research interests in autonomous vehicles and robotic systems, conventional and alternative energy technology, and MEMS/NEMS devices. Applications will also be accepted for allied mechanical engineering disciplines such as nonlinear dynamics and control, sensor technology, small and micro-scale propulsion systems, aerodynamics and aeroelasticity, thermal sciences, and vehicle dynamics.

Successful candidates are expected to establish a vibrant research program, obtain competitive external research funding, and participate actively in teaching at both the undergraduate and graduate levels. Applicants should submit a cover letter describing their research interests and qualifications, a curriculum vitae, and the names and addresses of three references. Please submit your application to mems-search [at] mems.duke.edu as a PDF (preferred) or Word file attached to your email. Duke University is an Affirmative Action/Equal Opportunity Employer.