Hu Guojun
| Type | Title | Author | Comments | Last updated |
|---|---|---|---|---|
| Blog entry | FEA Improves Reliability of Flip-Chip Packaging | Zhen Zhang | 3 | 4 weeks ago |
| Blog entry | Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface | shirangi | 4 | 4 weeks ago |