I am having problems in writing the umat and uexpan subroutines applicable to the creep model defined in
http://ascelibrary.org/doi/abs/10.1061/%28ASCE%29ST.1943-541X.0000375
Has anybody written the algorithm?
Prof. Markus Buehler from MIT will receive the 2014 Journal of Applied Mechanics Award for his paper "Bioinspired graphene nanogut" (Journal of Applied Mechanics, v 80, article 061009, 2013). Profs. Katia Bertoldi from Harvard University and Oscar Lopez-Pamies from University of Illinois will also receive the 2014 Journal of Applied Mechanics Award for their paper "Some remarks on the effect of interphases on the mechanical response and stability of fiber-reinforced elastomers" (Journal of Applied Mechanics, v 79, article 031023, 2012).
Hi,
I have observed in many cases that horizontal pressure vessel with saddle support due to the internal pressure gets circumferentially compressed (vertical deflection).
Can anyone expalin why it behaves so.
Attached is the pic showing the pressure vessel.
Regards,
Sagar
HI FRIENDS.
I AM WORKING ON NON LINEAR BUCKLING ANALYSIS PF COMPOSITE PLATE USING ANSYS SOFTWARE.I HAVE GIVEN GEOMETRIC IMPERFECTION USING FIRST BUCKLING MODE SHAPE.DID A NON LINEAR DISPLACEMENT CONTROLLED ANALYSIS.PROGRAM IS TERMINATING WHEN PROGRAM IS RUNNING.CAN ANYBODY HELP PLS. I WANT LOAD DISPLACEMENT CURVE .I AM WORKING ON COMPOSITE FLAT PLATE.
REGARDS
LAKSHMI NARAYANA
Most technologically relevant ferroelectrics typically lose piezoelectricity above the Curie temperature. This limits their use to relatively low temperatures. In this Letter, exploiting a combination of flexoelectricity and simple functional grading, we propose a strategy for high-temperature electromechanical coupling in a standard thin film configuration.
In this research work, simple, efficient,highly accurate and shear_lock free finite elements based on the Timoshenko beam theory have been developed (see details for numerical results).
Hi Everyone
Hai everyone.
Good day, i'm a new to XFEM who currently doing research in electronic field. I'm thinking about since the crack can be propagated without a crack tip by strain loading, how about the crack propagation by using thermal loading? I didn't see any example of this kind of problem, so can anyone tell me is that possible to do such simulation? Your suggestion is important for me and will be highly appreciated.
Thanks in advance.
