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Energy dissipation in polymer-bonded explosives with various levels of constituent plasticity and internal friction

Submitted by keyhani on
research

The ignition of energetic materials (EM) under dynamic loading is mainly controlled by localized temperature spikes known as hotspots. Hotspots occur due to several dissipation mechanisms, including viscoplasticity, viscoelasticity, and internal friction along crack surfaces. To analyze the contributions of these mechanisms, we quantify the ignition probability, energy dissipation, damage evolution, and hotspot characteristics of polymer-bonded explosives (PBXs) with various levels of constituent plasticity of the energetic phase and internal crack face friction.

A novel technology on dynamic interlaminar fracture toughness measurement of composites

Submitted by czhang on
research

Huifang Liu, Hailiang Nie, Chao Zhang, Yulong Li

Composites Sciene and Technology, 2018, https://doi.org/10.1016/j.compscitech.2018.07.040

 

Hailiang Nie, Tao Suo, Xiaopeng Shi, Huifang Liu, Yulong Li, Han Zhao

International Journal of Impact Engineering, 2018, https://doi.org/10.1016/j.ijimpeng.2018.08.004

 

Bio-inspired solution for optimal adhesive performance

Submitted by Antonio Papangelo on
research
adhesion; contact mechanics; bioinspired adhesion; nanolayers; microlayers

In recent years there has been a growing interest into high performance bioinspired adhesives. This communication focuses on the adhesive behavior of a rigid cylinder that indents an elastic layer coated on a rigid substrate. With the assumption of short range adhesive interactions (JKR type) the adhesive solution is obtained very easily starting from the adhesiveless one.

Converting viscoelastic Prony Series terms from ABAQUS to LS-DYNA

Submitted by Mukunda Madhava Nath on
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In Abaqus, 

g(t) = 1 - ∑(gi * (1-exp(-t/taui)); 

in which g and gi are dimensionless. 

 

In LS-DYNA, 

G(t) = ∑( Gi * exp(-betai * t) ); 

in which G and Gi are in N/m2

 

Based on this information, how do we transform the Prony Series terms from one code to another or vice-versa given I don't have the test data available.

 

Our new review on "Hydrogel Bioelectronics"

Submitted by hyunwoo on
research
hydrogel
bioelectronics

It is my first blog entry to iMechanica after long period of only reading.

In this review published in Chemical Soceity Reviews, we systematically revealed the design principles for bioelectronics and discussed hydrogels' merits and potential in bioelectronics.

 

Abstract

 

Filling a Void: Metal Additive Manufacturing for Aerospace with Synopsys, ELEMCA and CNES

Submitted by Simpleware on
research
simpleware
elemca
metal additive manufacturing
cnes
aerospace

Metal additive manufacturing enables production of complex metal parts that meet mechanical property specifications without the need for costly tooling. In addition, parts can be made in small batches or even manufactured on a “one-off” basis. Computed tomography (CT) scanning can be used to identify defects such as voids or inclusions that can occur in parts created through metal additive manufacturing, but in the past there was no way to determine how these manufacturing byproducts might affect performance.

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