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Call for abstracts: Industrial Applications of IGA and Meshfree Methods -- USACM Conference on Isogeometric Analysis and Meshfree Methods -- October 10-12, 2016, La Jolla, CA

Submitted by korobenko on

Dear Colleagues,

You are invited to submit an abstract to the thematic session "Industrial Applications of IGA and Meshfree Methods” at the USACM Conference on Isogeometric Analysis and Meshfree Methods taking place on October 10-12, 2016, in La Jolla, California, at the Estancia La Jolla Hotel and Spa.

The aim of our thematic session is to bring together researchers working in the industrial scale application of isogeometric and meshfree methods, to share recent advances, lessons learned, and to transfer knowledge between the two communities.

IMECE: Submit Your Abstract for Paper Presentation

Submitted by ASME-IMECE on

Real world challenges that face health care, transportation, space exploration, new product design and manufacture, and energy require interdisciplinary mechanical engineering approaches and perspectives.

Call for Papers - Optimization for Integrated Computational Materials Engineering (ICME)

Submitted by a12najafi on

The AIAA (American Institute of Aeronautics and Astronautics) Multidisciplinary Design Optimization Technical Committee (MDO TC) is very pleased to announce a call for papers to be presented in a series of special sessions on Integrated Computational Materials Engineering (ICME) within the AIAA SciTech conference. To this end, the MDO TC is soliciting papers with recent research, technological advancements, and systems level perspectives that address issues/challenges involved utilization of computational methods in optimization and design over multiple length scales from “processing”

Call for Papers-Integrated Computational Materials Engineering (ICME) for Structures

Submitted by a12najafi on

The AIAA (American Institute of Aeronautics and Astronautics) Structures Technical Committee (STC) is very pleased to announce a call for papers to be presented in a series of special sessions on Integrated Computational Materials Engineering (ICME) within the AIAA SciTech conference. To this end, the STC Technical Committee is soliciting papers with recent research, technological advancements, and systems level perspectives that address issues/challenges involved in the integration of computational materials models and design/structures over multiple length scales from “processing” to

Nanobrücken 2016: A Nanomechanical Testing Workshop & Hysitron User Meeting

Submitted by Douglas Stauffer on

Nanobrücken 2016: A Nanomechanical Testing Workshop & Hysitron User Meeting will take place March 2nd - 4th, 2016 at the INM - Leibniz Institute for New Materials in Saarbrücken, Germany. This will be the 6th edition of the now-annual Nanobrücken workshop series. 

As in the past, the workshop is open to all aspects of nanomechanical and nanotribological testing, including biomechanical, in-situ experimentation and theory/simulation.

WCCM 2016 -- symposium on Modeling Materials with Coupled Physics -- deadline extended January 24, 2016

Submitted by Stephan Rudykh on

Dear Colleagues,

12th World Congress on Computational Mechanics (WCCM XII) and 6th Asia-Pacific Congress on Computational Mechanics (APCOM VI) will be held will be held in Seoul, Republic of Korea, during 24 – 29 July, 2016. As part of this meeting, we are organizing a mini-symposium to address recent advances in modeling materials with coupled physics. Topics of particular interest include (but not limited to)

Call for Abstracts: 7th ICCM Berkeley - MS-054 Failure and instabilities in soft materials and geomaterials

Submitted by WaiChing Sun on

Dear colleagues, 

I am writing to invite your contirbution to the mini-symposium on failure and instability in soft materials and geomaterials co-organized by myself, Joshua White, Pencheng Fu, Nikolaos Bouklas, Wei Wang and Christian Linder for the upcoming ICCM conference at Berkeley. More information can be found in the URL listed below. 

http://www.sci-en-tech.com/ICCM/index.php/iccm2016/2016/schedConf/track…

IUTAM Symposium on Mechanics of Stretchable Electronics March 17-18, 2016

Submitted by jzsong on

Recently developed materials and mechanics concepts yield stretchable electronics, which has changed the way that people think about possibilities in the area of electronics and enabled many novel applications. These stretchable electronics will be subject to large, repeated deformation during manufacturing and service.  All these post significant challenges to the functionality and reliability of stretchable electronic devices.