Full time position at Intel: Material Analysis Lab Engineer
Position is immediately available and needs to be filled soon. Interested candidate can contact me at email below.
li.han [at] intel.com
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Material Analysis Lab Engineer |
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Description |
Position is immediately available and needs to be filled soon. Interested candidate can contact me at email below.
li.han [at] intel.com
|
|
Material Analysis Lab Engineer |
|
Description |
The Computational Mechanics and Methods Group (CM3) in the Department of Mechanical Engineering at the University of Kentucky is seeking highly self-motivated individuals who have great interest in the broad research area of computational solid mechanics and methods. Ideal applicants should have strong background in solid mechanics and great interest in computational modeling & simulation. Related research experience in material failure modeling and simulation is a plus.
Dear Colleagues,
I will join the School of Aerospace and Mechanical Engineering at the University of Oklahoma as a tenure-track Assistant Professor. I have two fully-funded Ph.D. student positions in my group. The students will work in general fields of computational materials science and solid mechanics. Please share the attached flyer with anyone who may be interested.
Thank you
Shuozhi Xu
A PostDoc/Research Associate Position is available immediately at Colorado School of Mines. The applicants should have a PhD degree in Mechanical Engineering, Materials Science or a relevant field, with a strong background in phase-field modeling and/or MD simulations, especially in the area of diffusionless phase transformation and ferroelasticity. Knowledge of machine learning and data analysis is a plus.
We are seeking a creative and enthusiastic postdoc to work at Duke University as part of a collaborative DOE funded project entitled "FAIR Data and Interpretable AI Framework for Architectured Metamaterials". Candidate should have phd in mechanical or materials engineering, with experience in mechanical metamaterials, the underlying physical principles, finite element simulations, and preferably some knowledge of AI/ML and desire to learn more.
Dr. Wentao Yan's group at the Department of Mechanical Engineering, National University of Singapore (NUS), focuses on metal additive manufacturing: computational modeling, experimental investigation and data analytics.
There are three openings for postdoctoral fellows available immediately. The candidates are required to have expertise in one of the following areas:
1) Thermal stress;
2) Fracture and cracking;
3) Uncertainty quantification and propagation;
4) Multi-objective optimization.
There is an opportunity to apply for a scholarship at the University of Ghent in Belgium as part of the DyMaLab laboratory on the following topic: Coupled experimental-numerical techniques to identify impact-dynamic properties of advanced materials. A detailed description is available in the attached PDF.
We are seeking a postdoctoral scholar to carry out research on large deployable structures for future spacecraft systems. The focus is on advancing viscoelasticity and viscoplastic modeling and characterization methods for high-precision optical structures based on composite materials. A background in solid mechanics and composite structures is required.
Our group at Manufacturing Demonstration Facility (MDF), Oak Ridge National Laboratory (ORNL) is looking for a postdoctoral research associate to work on Process Modeling for Polymer Composites Manufacturing. More details on the job posting are available at this link. Interested candidates should apply directly using that link.
A Postdoctoral opening is available in the area of toughening of thermoplastic adhesive tapes at Mechanica of Composites for Energy and Mobility lab at King Abdullah University of Science and Technology (KAUST).
Performance of secondary bonding or adhesive systems is a key challenges for the successful integration of composite. MCEM has a strong experience in improving toughness and stability of adhesive joints by controlling the dissipation mechanisms, via the design of the microstructure or by introducing spatially depending adhesive properties.