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undulation

Perturbation analysis of a wavy film in a multi-layered structure

Submitted by Jae-Hyun Kim on

A free surface in a multi-layer can experience an undulation due to surface diffusion during fabrication or etching process. In order to analyze the undulation, the elasticity solution for the undulating film is needed. Considering the undulation as a perturbation of a flat surface, a boundary value problem for 2D elasticity is formulated. The solution procedure is straightforward, but very lengthy especially for a multi-layer.