materials engineering

This position is no longer available.

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SEEKING POSTDOCTORAL RESEARCH ASSOCIATES – NOV# E00149FY16

Research Areas:  nanoindentation and small-scale mechanical behavior of materials

Department of Materials Science and Engineering at Texas A&M University in College Station, Texas

Characterisation of Energy Absorbing Materials for Helmet Liner Applications

Level: PhD, Funded €40-70k, 3 years

Applications are invited for a tenure-track faculty position at the assistant or associate professor level in the area of computational materials science and engineering. Candidates from a range of disciplines such as materials science, chemistry, physics, chemical engineering, and mechanical engineering are all welcome to apply.

Please see www.ul.ie/hrvacancies for details.

Department/
Research Centre:  Dept. of Mechanical, Aeronautical and Biomedical Engineering/ Irish Centre for Composites Research (IComp)

Title
of Post:    Post-Doctoral
Researcher on Structural Composite Bonded Repair

Contract
Type:  Specific Purpose

Salary:  €37,750 - €46,255 p.a.

Informal
enquiries regarding the posts may be directed to:

Dr. Trevor Young,

The Department of Engineering and St Hugh's College at Oxford University
have a University Lectureship available in the area of Solid Mechanics
and Materials Engineering.  The closing
date for applications is 31st May 2012.  Further information can be
found in the attached files.

We look forward to receiving your application.

Alan Cocks

The Department of Engineering and Balliol College at Oxford University have a University Lectureship available in the area of Solid Mechanics and Materials Engineering.  We would  be particularly interested in receiving applications in the general area of composite and lightweight materials, including, polymer, metal, ceramic, biological and multifunctional composites, foams and lattice materials. The closing date for applications is 16th January 2012.  Further information can be found in the attached files.

We look forward to receiving your application.

Alan Cocks