Topic: PhD Fellowship in “Risk
and Reliability of Offshore Wind Turbine Foundations”
Location: NTNU, Trondheim, Norway
Deadline: 09 Mar 2012
Salary: NOK 391 100 to NOK 448
100 per year (equivalent of approximately £43 000 to £50 000)
There are several openings for semiconductor process integration at IBM Microelectronics. The reqiured background is quite broad, specifically mechanical engineering background, reliability, failure analysis and modeling with experience in BEOL process and integration. To see more details and to apply online, please click the link below.
https://jobs3.netmedia1.com/cp/job_summary.jsp?job_id=STG-0424220
The word "failure" can mean different things to different people. Over the past couple of years, my interactions with various groups from industry has shown me that for some people failure means catastropic fracture/buckling while for others it can mean highly localized plastic yielding. Even for relatively simple sandwich composite structures, there is no clearly agreed upon definition of the word.
Hello,
I am wondering if there is a source code for first-order reliability method (FORM) or second-order (SORM) available out there, ideally for Matlab but others would be interesting as well.
If not, has anyone programmed this themself? What literature source did you base it upon?
Thanks in advance for any help!
On Aug 10, 2009, Semiconductor International (SI) Newsbreak published a report on my work in AMD about 3D fracture study of underfill delamination as the top story in that issue. I have never imagined that. Except the pleasure I received from this good news, I wonder if this work is also interesting to iMechanica community. For that reason, I attach here the SI news report and the original paper published on ITherm2008 Proceedings. Welcome any comments and thoughts.
Reliability
Analysis Associates, Inc.
1440 North Lake Shore Drive, #30F,
Chicago, IL 60610
Phone:
312-274-0542; Fax: 312-274-0574; E-mail: reliability [at] nidus.com
Specializing in
the recruitment of Reliability, Maintainability,
Test,
Logistics, and System Safety Engineers
RAA, Inc. is seeking candidates
for the position described below:
The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.
Our agency, Reliability Analysis Associates, Inc., specializes in recruiting Reliability Engineers and related skills. For a client in the oil business in Houston, TX we are seeking candidates for two positions that require knowlege of finite element analysis, crack growth, reliability, and low cycle fatigue. The two job descriptions are attached.
X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.
Abstract:
