thin film

POST-DOCTORAL RESEARCH POSITION IN EXPERIMENTAL MATERIALS SCIENCE

School of Engineering and Applied Sciences, Harvard University

The Harvard School of Engineering and Applied Sciences seeks highly qualified applicants for a post-doctoral research position in experimental materials science.  The successful candidate will participate in a project to design an apparatus for high-temperature calorimetry on nanoscale quantities of materials. This apparatus will be used to study phase transformations in complex ternary and quaternary materials systems.

We have recently studied the atomic scale structural stability of
freestanding wavy gold (Au) nanofilms using molecular dynamics
simulations. In recent years, wavy or patterned structurs have shown great promise for applications in various emerging technologies including fuel cells
engineering, tissue engineering, biomedical engineering, creation
of counterfeit-resistant documents , nanolithography in microelectronics, optoelectronics, nanomachinesand many others. It is out of question that the success of these novel applications lies on one crucial factor – the

This is a fully funded research project at the University of Waterloo, Canada. The objective is to construct a PECVD and a UV cure chambers for porous dielectric thin film depositions. In addition to building chambers, the candidate will conduct experiments in thin film fracture and small scale deformation. Please email your CV to tttsui [at] uwaterloo.ca

Integrating porous low-permittivity dielectrics into Cu metallization is one of the strategies to reduce power consumption, signal propagation delays, and crosstalk between interconnects for the next generation of integrated circuits. However, the porosity and pore structure of these low-k dielectric materials also strongly affects other important material properties besides their dielectric constant.

Many studies on the thin film/substrate structure and its failure mechanism were reported in recent years. The direct experimental results of thin film/substrate structure by scanning electron microscopy (SEM) presents an intriguing problem:there exists a buckling failure mechanism at the lateral edge of metal film under pure bending. The qualitative theoretical analysis has been done on such buckling failure of thin film/substrate structure.

This symposium is part of the Spring 2008 ACS National Meeting and Exposition , to be held at New Orleans, Louisiana, from Sunday, April 6 to Thursday, April 10, 2008.

Organizers: Christopher M. Stafford (NIST), Adam J. Nolte (NIST), Rui Huang (UT Austin)

Sponsors: ACS Division of Polymeric Materials: Science and Engineering (PMSE) and National Science Foundation

Technical Program: