Many studies on the thin film/substrate structure and its failure mechanism were reported in recent years. The direct experimental results of thin film/substrate structure by scanning electron microscopy (SEM) presents an intriguing problem:there exists a buckling failure mechanism at the lateral edge of metal film under pure bending. The qualitative theoretical analysis has been done on such buckling failure of thin film/substrate structure. The experimental results and theoretical analysis are helpful to understand the extrinsic stresses or deformations that are induced by external physical effects. Accepted by Appl. Phys. Lett.
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| Buckling behavior of metal film-substrate structure under pure bending.pdf | 1.51 MB |