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Nanomechanics symposium at SES 2010

Oden Warren's picture

Dear Colleague: Please consider submitting your nanomechanics related abstract to Symposium 4-1 ("Nanomechanics: Beyond Modulus and Hardness") of the 47th Annual Technical Meeting of Society of Engineering Science, which takes place October 4-6, 2010 at Iowa State University, Ames, IA. The deadline for abstract submission is 5:00pm CST, Monday, June 7, 2010. The meeting's homepage can be found at www.ucs.iastate.edu/mnet/ses2010/home.html.

4-1 Nanomechanics: Beyond Modulus and Hardness
Nanoindentation (and its standard outputs of elastic modulus and hardness) has been the staple of nanomechanical testing for nearly two decades. However, in recent years both the technique and its instrumentation have been adapted to yield additional material quantities and new modes of nanoscale measurement. The focus of this symposium is on advanced and novel nanomechanical testing concepts. Examples of appropriate topics include but are not limited to in-situ nanomechanical testing such as in electron microscopes, nanomechanical testing in non-nanoindentation modes such as nanocompression testing of pillars and nanotensile testing of wires and ribbons, and nanoindentation of viscoelastic materials. Submissions concerning elucidation of deformation mechanisms are especially encouraged. Organizer: Oden Warren, Hysitron, Inc., Minneapolis, MN, owarren@hysitron.com.

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