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Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology

Rui Huang's picture

At the 2007 ASME Applied Mechanics and Materials Conference (McMat 2007)

June 3-7, 2007, Austin, Texas

This symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, microelectromechanical systems, and biomedical devices. The key idea is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome. Topics of interest include, but not limited to:

  • Mechanics and materials in microelectronics: Cu/low k interconnects, chip-package interaction, and transistor strain engineering
  • Mechanics of materials in macroelectronics: large-area flexible electronics, organic electronics, thin-film transistors, rollable displays
  • MEMS/NEMS devices: integration and reliability
  • Ferroelectric and ferromagnetic thin films: domain structures, multi-field interactions
  • Integrated biological structures: biomechanics and biomaterials
  • Biomedical devices: medical implants, etc.
  • Novel mechanical testing and metrology for integrated small structures
  • Stress-induced structural evolution and self assembly at micro/nano-scales

Deadline for abstract submission: February 16, 2007.

To submit your abstract, please go to Technical Tracks. Select Track “TK 16 Integrated Structures” and Topic 16-2 for this symposium.

This Symposium is organized by the Technical Committee on Integrated Structures (TCIS) of the ASME Applied Mechanics Division. The committee members include: Ibrahim Bekâr (Intel), Xiaohu Liu (IBM), Dureseti Chidambarrao (IBM), Teng Li (University of Maryland), Jun Lou (Rice University), Wei Lu (University of Michigan), Xi Chen (Columbia University), Xiao-Yan Gong (Medical Implant Mechanics LLC), Jun He (Intel, co-chair), Rui Huang (University of Texas, co-chair).


Rui Huang's picture

Here is an evolving list of speakers who have agreed to present their works at this symposium. I will update this list as we receive more abstracts or informal commitments.

  • Zhigang Suo, Harvard University
  • Carl V. Thompson, MIT
  • David Clarke, University of California at Santa Barbara
  • Paul Ho, University of Texas at Austin (Interconnects and Packaging)
  • Martin Gall, Freescale
  • Jeff Zhao, Texas Instruments
  • Dureseti Chidambarrao, IBM (CMOS strain engineering)
  • Klaus Schwarz, IBM (defect strain engineering)
  • Min Huang, Texas Instruments
  • Sanjay Banerjee, University of Texas at Austin (Director of Microelectronics Research Center)
  • John X.J. Zhang, University of Texas at Austin (MEMS/BioMEMS)
  • Long-Qing Chen, Penn State University (ferroelectric thin films)
  • David Read, NIST (metrology)
  • Chris Stafford, NIST (soft materials metrology)
  • Xi Chen, Columbia University (nanoindentation)
  • Xiao-yan Gong, Medical Implant Mechanics LLC (medical implants)
  • Zhenyu Zhang, Oak Ridge National Lab
  • Taher Saif, University of Illinois
  • Teng Li, University of Maryland (flexible electronics)
  • Darran Cairns, West Virginia Univ. (macroelectronics)
  • Ananth Dodabalapur, University of Texas at Austin (organic electronics)
  • Hanqing Jiang, Arizona State Univerity (flexible electronics)
  • Jun Lou, Rice University
  • Thomas Buchheit, Sandia National Lab (MEMS/NEMS)
  • Wei Lu, University of Michigan (self assembly)
  • Ishwar K. Puri, Virginia Tech (self assembly)
  • Vivek Shenoy, Brown University
  • Pradeep Sharma, University of Houston
  • Gemunu Gunaratne, University of Houston
  • Wei Hong, Harvard Univeristy
  • Yong-Wei Zhang, National University of Singapore
  • Cheng-Hsin Chiu, National University of Singapore
  • Jun He, Intel
  • Rui Huang, University of Texas at Austin


Rui Huang's picture

The technical program of this symposium is now finalized as follows.

Session 16-2-1: Cu/low k interconnects I (Monday, June 04, 09:45-11:45 AM)

Session Chairs: Jun He and Rui Huang

  • Carl Thompson (MIT), Void Dynamics During Electromigration in Cu Interconnects (keynote)
  • Martin Gall (Freescale), Electromigration Early Failure Detection in Dual-Inlaid Cu Interconnects
  • Lijuan Zhang (UT Austin), Electromigration Reliability of 60 nm Dual Damascene Cu Interconnects
  • Jun He (Intel), Interconnect scaling, electromigartion lifetime, and critical void volume


Session 16-2-2: Cu/low k interconnects II (Monday, June 04, 1:15-3:15 PM)

Session Chairs: Jun He and Rui Huang

  • David Read (NIST), AC Fatigue Tests of Damascene Interconnect Structures (keynote)
  • Jin An (UT Austin), The Influence of grain orientation on local stresses in 180 nm Cu Interconnects
  • Youbo Lin (Harvard), Structure, mechanical properties and fracture of organosilicate glass thin films
  • Zhigang Suo (Harvard), Effect of coating on the reliability of stiff island on compliant substrate


Session 16-2-3: Chip-package interactions (Monday, June 4, 3:30-5:30 PM)

Session Chairs: Rui Huang and Ibrahim Bekâr

  • Paul Ho (UT Austin), Impact of Chip-Packaging Interaction on Interfacial Cracking of Multilevel Cu/Low-k Interconnect Structures (keynote)
  • Jie-Hua (Jeff) Zhao (TI), Packaging optimization to mitigate stress induced parameter shift in precision devices
  • Rui Huang (UT Austin), Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films
  • Zhenyu Zhang (ORNL), Quantum Stability of Ultrathin Metal Overlayer on Semiconductor Substrates


Session 16-2-7: Metrology for integrated small structures (Tuesday, June 5, 9:45-11:45 AM)

Session Chairs: Rui Huang

  • Chris Stafford (NIST), Surface Wrinkling as a Metrology Tool (keynote)
  • Xi Chen (Columbia Univ), Measuring elastoplastic properties of thin films by using nanoindentation
  • Bin Li (UT Austin), Fabrication and Mechanical Characterization of Silicon Nanolines
  • Kristen Mills (Univ. Michigan), Nano-cracking of plasma-oxidized polydimethylsiloxane and some of its applications in nano/biotechnology


Session 16-2-5: Mechanics and materials of macroelectrinics (Tuesday, June 5, 1:15-3:15 PM)

Session Chairs: Teng Li

  • Ananth Dodabalapur (UT Austin), Organic and Polymer Transistors for Flexible Electronics  (keynote)
  • Darran Cairns (West Virginia Univ), Mechanical Studies of Indium Tin Oxide Coated Polymer Films for Flexible Displays
  • Teng Li (Univ. Maryland), Suitably Patterned Thin Films of Stiff Materials As General Platforms For Flexible Electronics
  • Hanqing Jiang (Arizona State Univ), Mechanics of Stretchable electronics


Session 16-2-6: Mechanics of integrated MEMS/NEMS (Tuesday, June 5, 3:30-5:30 PM)

Session Chairs: Jun Lou

  • David Clarke (UC Santa Barbara), The Concurrent Effects of Adhesion, Creep and Roughness on the Propensity for Stiction of Small Scale Mechanical Contacts (keynote)
  • John X.J. Zhang (UT Austin), Nano Opto-electro-mechanical Characterization of Neuron Membrane Mechanics
    Under Growth and Differentiation
  • Thomas Buchheit (Sandia), Characterizing the Failure Strength and Fatigue Reliability of a Bulk Silicon Micromachining Process
  • Jun Lou (Rice Univ.), Nanomechanical Testing Using NEMS Devices Based on Suspended Nanotubes/Nanowires

Session 16-2-4: Front-end strain engineering (Wednesday, June 6, 9:45-11:45 AM)

Session Chairs: Dureseti Chidambarrao

  • Sanjay Banerjee (UT Austin), Strain and Bandgap Engineered High Channel Mobility MOSFETs (keynote)
  • Klaus Schwarz (IBM), Defect Modeling in the Context of Strain Engineering
  • Anthony Domenicucci (IBM), Measuring Channel Strain in MOSFET Devices Using TEM Techniques
  • Jagannathan Rajagopalan (Univ. Illinois), Thermally Activated Plastic Strain Recovery in Freestanding Nanocrystalline Aluminum Thin Films


Session 16-2-8: Defects and reliability of integrated devices (Wednesday, June 6, 1:15-3:15 PM)

Session Chairs: Xiao-Yan Gong and Rui Huang

  • Zhigang Suo (Harvard), A method to analyze dislocation injection from sharp features
  • Gang Feng ( Brown Univ.), Modeling Interfacial Misfit Dislocations In A Heteroepitaxial Island
  • Xiao-Yan Gong (Medical Implant Mechanics LLC), Reliability of Nitinol Stents
  • Bo Yang (Florida Inst. Of Tech.), Interactive Growth of Delamination and Channel Cracks in Thin Films
  • Zhen Liu (CCNY), Thin film surface evolution and stress relaxation due to coupled surface and grain boundary diffusion

Session 16-2-9: Self-assembled materials and structures I (Wednesday, June 6, 3:30-5:30 PM)

Session Chairs: Rui Huang and Wei Lu

  • Martin Dunn (Univ. Colorado), A Computational Design Methodology for Self-Assembled Micro and Nanostructures
  • Wei Hong (Harvard Univ.), Step dynamics on a silicon surface due to the combined action of strain and electric current
  • Robert Kukta (SUNY-SB), Self-assembly of Nanostructures on Topographically Pattern Substrates
  • Long-Qing Chen (Penn State Univ), Phase transitions, domain structures and switching in nanoferroelectrics
  • Nickolay Shestopalov (UT Austin), Controlled self-assembly: Basic principles and simulations

Session 16-2-10: Self-assembled materials and structures II (Thursday, June 7, 8:30-10:30 AM)

Session Chairs: Wei Lu

  • Ishwar K. Puri (Virginia Tech), Attributes of self assembly at different length scales: from nano to micro (keynote)
  • Pradeep Sharma (Univ. of Houston), Engineering Perfect Long Range Order in Self-assembling Nanostructures
  • Yaoyu Pang (UT Austin), Effect of elastic anisotropy on self-assembly of surface patterns in epitaxial thin films
  • Cheng-Hsin Chiu (Singapore), The Formation of Nanostructures on the Stranski-Krastanow Systems by Surface Undulation

Session 16-2-11: Self-assembled materials and structures III (Thursday, June 7, 10:45 AM -12:45 PM)

Session Chairs: Wei Lu and Rui Huang

  • Vivek Shenoy (Brown Univ.), Metastability in 2D Self-Assembling Systems (keynote)
  • Yong-Wei Zhang (Singapore), Modeling the Growth of Ordered Heteroepitaxial Quantum Dots and Quantum Rings Using Guided Self-Assembly
  • Wei Lu (Univ. Michigan), Self-assembly of metallic quantum dots on a semiconductor substrate
  • Gemunu Gunaratne (Univ. Houston), Nanoscale Self-Assembly: A Theoretical Analysis

Zhigang Suo's picture

Rui:  This is very well organized and I'm looking forward to the symposium.  Thank you and your co-organizers for getting people together.

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