Creep Analysis of Lead-Free Solders Undergoing Thermal Loading

Lead and its compounds have been widely used for many years in the electronics industry. However, the global demand to reduce the use of hazardous materials has compelled electronics manufacturers to consider the use of lead-free materials in future products. This transition has heightened the necessity for new finite element material models that can be used to evaluate the reliability of lead-free solders. Along with extensive nonlinear analysis capabilities, Abaqus/Standard includes a variety of creep models - including those applicable to lead-free solders, making it a reliable design tool for the electronics industry.