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Hi everyone

I have a question regarding cohesive zone models/laws/parameters for the interface between carbon nanotubes and polymers.  There seems to be a handful of literature on obtaining tangential (shear) cohesive zone information for this type of interface.  For example, there are a couple of experimental and molecular dynamics simulations I have found that try to obtain the cohesive zone parameters for shear.  The problem is that they are all for nanotube pullout which means that they only obtain the shear information.

Hi friends,

I have a shell model in solidworks, I want to full it's volume But don't know that how do it? edgs of this model are discontinuous curve.

please help me. (picture of this model is put below)

Mina.

The Institute of Structural Analysis at Leibniz Universität Hannover invites applications for a

Scientific coworker / PhD Candidate (Salary scale E13 TV-L)

The position is available from now.  The work should lead to a PhD thesis.

Tasks:

The effect of crystal size and initial dislocation density on surface roughness evolution in FCC single crystals during the early number of cycles of mechanical cyclic loading is investigated using three dimensional discrete dislocation dynamics simulations. Crystals having size less than 2 μm show early development of surface slip localization, while larger ones show a more uniform distribution of surface steps. The surface roughness is found to increase with increasing number of loading cycles with larger crystals showing a high roughening rate compared to smaller crystals.

Hello. 

I'm doing piezoelectric analysis using abaqus CAE v6.12.

Specifically, what I'm doing now is to make the bimorph piezoelectric harvester model using Abaqus CAE

and to validate my model.

My FE model is made based on the model developed by A Erturk and D J Inman in their paper,

'An experimentally validated bimorph cantilever model for piezoelectric energy harvesting from base excitations'

They presented the analytical solution for voltage output and experimental validation is also presented in this paper.