A quality map of transfer printing
M.B. Tucker, D.R. Hines, T. Li, A quality map of transfer printing, Journal of Applied Physics, 106, 103504, (2009) DOI: 10.1063/1.3259422
Blog posts
Snap-through instability of graphene on substrates
T. Li, Z. Zhang, Snap-through instability of graphene on substrates, Nanoscale Research Letters,DOI: 10.1007/s11671-009-9460-1 (2009). (Open access)
Announcing free version of Kalker's rolling contact model
Dear all,
Herewith I would like to announce that we have decided to make our CONTACT software publicly available. You can obtain a free copy at the web-site www.kalkersoftware.org. We hope that the software is beneficial to you. We further hope that you give us helpful feedback in return.
ansys
Hi, i am working with ansys multiphysics, i want to apply a hydrostatic pressure, gradient of pressure, as a load on a cylindrical structure. i found that commande on its help "Main Menu> Preprocessor> Loads> Define Loads> Settings> For Surface Ld> Gradient" but i dont know how to use it. is there any recommandation? thx
PhD Studentship: Rock Fracture and Fragmentation
PhD Studentship: Rock Fracture and Fragmentation
Imperial College London - Department of Earth Science and Engineering
2D dynamic analysis
In the figure I showed a mechanism, I want to make an analysis for that. consider the circles in the figure as cylenders which can be seen in the top view. these circles are regular cylenderical parts. I made the fig in paint thats why circle don't seem to be regular. I want to analyze the angle that at given angle, whether the rolling flow of these cylenders will be blocked or not. Please tell me some software to analyze in 2d Prefferably or 3d. Please help me. I'm in intense need.
A new Method for Detection of Degradation in Die-Attach Materials by In-Situ-Health Monitoring of Thermal Properties
The application of electronic products is established in many fields of everyday life, for example in automotive industry, medical or communication technology. This leads to the necessity of investigation of safety and reliability of such components. During lifetime testing of the electronic component different loads and mechanisms can lead to degradation and failure. For die attach materials these failures can be cohesive or adhesive in their nature.
how to get the temperature information after first time increment
Dear All,
I am just wondering if some one can help me in finding the solution temperature after the first time increment solution. The objective is to locate the elments that crosses the vaporization temperature.
for example
I need to use a command like this after the first time step
NSEL,S,TEMP,,TBOIL,TMAX
in the above macro how do get "TEMP" i.e., the nodal temperature after the first solution time
Thanks in advance,
with warm regards,
Pranesh