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Wafer Butterfly Valve

Submitted by Anonymous (not verified) on

Wafer Butterfly Valve

 

Wafer Butterfly Valve Specification: DN50-600

Wafer Butterfly Valve Temperature: -15°C~120°C

Wafer Butterfly Valve Pressure: 1.0MPa/1.6MPa

Wafer Butterfly Valve Materials of Body: Ductile Iron (GGG40,GGG50).Cast Iron (GG25),Stainless Steel 

Wafer Butterfly Valve Materials of Disc: Stainless Steel, Nickel Plated Ductile Iron, Ductile Iron Coated Plastic

Experiments in anti-plane deformation of thin films

Submitted by Thanasis Zisis on

Dear all,

I was curious whether there are any
experimental information and / or results regarding the out of plane (anti-plane)
deformation of (very) thin films. For example an elastic thin film subjected to anti-plane loading on its surface. Any other suggestions regarding possible applications of anti-plane loading conditions in thin films would be appreciated. 

 

Thanks a lot,

Thanasis

ICNAAM 2014; Symposium on "Analysis and Design of Multi Functional Composite Structures"

Submitted by rameshgupta on

Call for Papers



On behalf of organizing committee, it gives us immense pleasure to invite you, your co-workers and students to the Symposium on Analysis and Design of Multi-Functional Composite Structures as part of the 12th International Conference of Numerical Analysis and Applied Methematics (ICNAAM 2014) to be held at Rodos Palace, Rhodes, Greece, between 22--28 September 2014.

Symposium Synopsis

RA position available in Piezoelectric sensors

Submitted by zhappybird on

A RA (MS level) position is available in the Department of Engineering Technology, University of North Texas-Denton in the fields of piezoelectric sensor modeling and experiment. The position will start from Summer, 2014. Candidates should have a Bachelor/Master's degree in engineering mechanics, mechanical engineering or electrical engineering with good academic standing and should have some experiences in the following:

DCB test - CONTINUUM SHELL ELEMENTS vs SOLID ELEMENTS

Submitted by davidrbmelo on

Hello,

I modelled a 3-D DCB (Double Cantilever Beam) test specimen to simulate crack propagation (delamination) in composite materials.
To do so, I used surface cohesive properties between plates in Abaqus/Explicit, and applied a displacement at the plates tips.

When I used continuum shell elements the crack propagated as expected and the delamination occurred.