Skip to main content

FINAL CALL FOR PAPERS:Computational Biomechanics for Medicine V (Beijing, September 24, 2010) in conjuction with MICCAI 2010

Submitted by adwit on

DEADLINE EXTENSION

Computational Biomechanics for Medicine  V Workshop

http://school.mech.uwa.edu.au/CBM2010/,

http://cbm.mech.uwa.edu.au/

will be held in Beijing on September 24, 2010,

in conjunction with MICCAI 2010 http://www.miccai2010.org/. Submission deadline: June 14 (extended till June 18) 

Continuum Mechanics of Line Defects in Liquid Crystals and Liquid Crystal Elastomers

Submitted by Amit Acharya on

Amit Acharya and Kaushik Dayal

 (To appear in Quarterly of Applied Mathematics)

This paper presents a generalization of traditional continuum approaches to liquid crystals and

liquid crystal elastomers to allow for dynamically evolving line defect distributions. In analogy with

recent mesoscale models of dislocations, we introduce fields that represent defects in orientational

and positional order through the incompatibility of the director and deformation ‘gradient’ fields.

Mohr Coulomb model -Cap model

Submitted by lianna on

Hi

I have a problem with the simulation of Mohr Coulomb problem. I want to set the properties of a sand. I use the experimental data from papers and i try to find the bearing capacity for a footing on sand. I set density ρ, E modulus of elasticity , ν Poissoin's ratio and for the Mohr Coulomb model i set φ shear strength, ψ dilatancy , c cohesion (a very small value=0.00001 ) for strain 0 . Does it need anything else? Does it need for hardening parameters any diagram for cohesion -plastic strain for the Mohr Coulomb model? 

Stress intensity factors at crack tip for beam with a hole

Submitted by parisa on

Hi everybody,

I am dealing with a beam with a hole containing a crack loaded at the mid-span. I am wondering if the stress intensity factors

(KI, KII) closed form solution have been expanded for this case or not? I would appreciate if anybody could hlep me about this

case.

Thank you,

Parisa

Materials and Mechanics for Stretchable Electronics

Submitted by Jianliang Xiao on

A review paper on stretchable electronics written by Professors John A. Rogers, Takao Someya, and Yonggang Huang was published in a recent issue of Science . This paper gives a nice summary on the recent advances in inorganic and organic stretchable electronics. Materials, structures and mechanics of these systems are discussed. Many attractive applications of stretchable electronics are introduced, such as stretchable silicon circuit, electronic eyeball camera, and flexible LED display. 

SES 2010 Annual Technical Meeting - Call for Papers

Submitted by Wei Hong on

The Society of the Engineering Science is sponsoring the 47th Annual Technical Meeting (SES2010) on October 4-6, 2010 at Iowa State University in Ames, IA. The meeting is held on biannual basis as a standalone meeting to foster and promote the exchange of ideas and information among the various disciplines of engineering and the fields of physics, chemistry, mathematics, bioengineering and related scientific and engineering fields.