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Call for nominations for SES awards

Submitted by Taher A Saif on

 

The Society of Engineering Science (SES) oversees several awards and honors to members and eminent scholars of the field. A total of five medals are offered on an annual basis as well as election to Fellow grade of the Society. The awards are: A.C. Eringen Medal, Engineering Science Medal, William Prager Medal, G.I. Taylor Medal and the SES Young Investigator Medal.

 

Multiple postdoctoral research positions at Nanyang Technological University, Singapore

Submitted by Kun Zhou on
job

We are looking for three postdoctoral researchers to work at Nanyang Technological University, Singapore. 

1. Two researchers are to work on water remediation and desalination using computational methods at the atomistic level.  

2. One researcher is to work on fracture behavior of weldments using computational methods at the microstructural leve.

Post-doc position damage/fracture (position filled, thank you)

Submitted by Nicolas MOES on
job
3D fracture

To improve further computational tools for fracture, we need a 

talented phd. We are developping transition models from damage

to fracture  for several type of materials (quasi-brittle and ductile).

The position will be open until filled. Please send me your CV

if you are interested. 

The theoretical framework is the Thick Level Set model for damage (TLS)

and the numerical implementation uses level sets and the extended

finite element  method (X-FEM).

The research team currently gathers 9 persons.

Computational Biomechanics for Medicine X (5 October 2015, Munchen, Germany): A MICCAI 2015 Satellite Workshop. Second Call for Papers. Paper submission deadline June 08

Submitted by adwit on

Computational Biomechanics for Medicine X (http://cbm.mech.uwa.edu.au/) will be held in Munich, Germany, on 5 October 2015, in conjunction with MICCAI 2015 (http://www.miccai2015.org/).
 

SES2015: Symposium on “Mechanics of Instability and Interfacial Adhesion in Bio-Compatible Electronics”

Submitted by ShuodaoWang on
conference

Dear colleagues and friends,

Please consider to contribute a talk at the symposium of “Mechanics of Instability and Interfacial Adhesion in Bio-Compatible Electronics”, organized for the 52nd Annual Technical Meeting of the Society of Engineering Science (SES). The SES 2015 meeting will be held at Texas A&M University, Oct 26-28, 2015.  Abstracts are due Jun 26, 2015. 

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