Dear colleagues and friends,
Please consider to contribute a talk at the symposium of “Mechanics of Instability and Interfacial Adhesion in Bio-Compatible Electronics”, organized for the 52nd Annual Technical Meeting of the Society of Engineering Science (SES). The SES 2015 meeting will be held at Texas A&M University, Oct 26-28, 2015. Abstracts are due Jun 26, 2015.
This symposium aims to offer a forum to foster discussions on the latest mechanics advances in the instability and interfacial adhesion in heterogeneous, integrated micro-structures and their applications in bio-compatible electronics. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome. Two sessions will be organized for the following topics: (a) Mechanics and instability in hard-soft integrated systems; and (b) Adhesion and fracture at bio-electronics interfaces.
Abstracts to this symposium can be submitted here. For more information about SES 2015 please visit http://ses-2015.org.
We look forward to having you join us!
Best regards,
Shuodao Wang
Assistant Professor at Oklahoma State University
shuodao.wang [at] okstate.edu