A postdoc position is available immediately in the School of Mechanical Engineering at Gerogia Tech. Interested persons with atomistic/molecular level simulation of metal/polymer interfaces are invited to contact Jianmin Qu at jq [at] gatech.edu (jq[at]gatech[dot]edu)
I am looking for two postdocs in the analytical and computational modeling areas. One position will focus on the theoretical and computational modeling of microstructure-modulated failure processes, with an emphasis on nanocrystalline materials. The other will focus on hypervelocity impact fragmentation problems, including planetary scale impact and fragmentation. The latter position is available immediately, and the former is available as of June 1, 2008.
Maney Publishing are pleased to announce that 30-day free trials are now available to individuals and institutions interested in our Materials Science and Engineering journals. To apply for a free trial simply follow the link and complete the online form. We will confirm your trial start date via e-mail and will be in contact with you prior to the expiration of your trial to answer any questions you may have.
As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME Applied Mechanics Division (AMD).
When and Where: October 31 - November 6, 2008, Boston, Massachusetts.
Abstract submission deadline: March 3, 2008
Evolving from earlier meetings on erosion, the International Conference on Liquid and Solid Impact (ELSI-IX) and the International Conference on Erosive and Abrasive Wear (ICEAW-II), the 1st International Conference on Abrasive Processes (ICAP-I) will be held in the historic city of Cambridge, England, 21-25 September 2008.
You are invited to join international delegates for this fully residential conference by submitting an abstract by 27 January 2008. Details can be found at www.icap.elsevier.com
Hallo,
I'm using ANSYS for study the internal stresses of a trilayer structure resulting after a cooling process. The middle layer (the solder) has temperature dependent material properties and the other two layers can be considered temperature indipendent mat. properties. If I use a static analysis the software uses the material properties reffered to final temperature.
For an linear elastic analysis is this a realistic procedure?
If the solder deforms plastically at high temperature and not at final temperature..how can I do?
Ting Zhu, Ju Li, Amit Samanta, Austin Leach and Ken Gall, “Temperature and strain-rate dependence of surface dislocation nucleation”, Physical Review Letters, 100, 025502 (2008).
PRL 100, 035503 (2008) Jianyu Huang, Feng Ding, Boris I. Yakobson
The International Workshop on Mechanics of Wood and its Applications in Wind Energy Technologies will take place 10-12 November 2008 in Dhulikhel, Nepal.
Hi everyone out there...
Now i'm working on biomechanics research project which deals with the articulating surface of joint replacement, where one of the main problem were the wear of sliding contact (i.e., metal on polymer,metal on metal or polymer on ceramics).wear debris or particles generated from this articulating surface can causes the damage of the bone cell around the joint replacement.My question are;
