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A new Method for Detection of Degradation in Die-Attach Materials by In-Situ-Health Monitoring of Thermal Properties

Submitted by mazloum on

The application of electronic products is established in many fields of everyday life, for example in automotive industry, medical or communication technology. This leads to the necessity of investigation of safety and reliability of such components. During lifetime testing of the electronic component different loads and mechanisms can lead to degradation and failure. For die attach materials these failures can be cohesive or adhesive in their nature.

Announcement for the 5th Conference on Advances in Mechanical Engineering and Mechanics - Tunisia

Submitted by fehmi.najar on

We are pleased to announce the first call for papers for the 5th International Conference on Advances in Mechanical Engineering and Mechanics (ICAMEM2010) which will be held in Hammamet, Tunisia from December 20th to 22nd, 2010.

 

Postdoctoral Research Associate at the University of Massachusetts Amherst

Submitted by ashwin on

A postdoctoral position is available starting immediately in the area of mechanics and electronic structure of graphene. The ideal candidate will have a background in materials science/computational physics/quantum chemistry with specific expertise in density functional theory and atomistic simulations. The initial appointment will be for a period of two years, renewable annually contingent upon satisfactory performance.

ICEM 14 - Poitiers, France, 4 - 9 July 2010

Submitted by Fabrizio Scarpa on

ICEM 14 - 14th International Conference on Experimental Mechanics

 Poitiers, France, 4 - 9 July 2010

 

Extended deadline for Abstracts: 25 October 2009

 

We will organise a session on Smart Materials and Structures. I invite you to submit an abstract through the conference website http://www.icem14.fr

 

Regards,

 

Fabrizio Scarpa