Electroelasticity of polymer networks
This work introduces a new microscopically-motivated model for the electromechanical response of elastomers:
The merit of this novel model is demonstrated in the following paper
This work introduces a new microscopically-motivated model for the electromechanical response of elastomers:
The merit of this novel model is demonstrated in the following paper
Dear Fellow Members,
I am currently pursuing my PhD research under the supervision of Prof. Ralf Müller at the Institute for Applied Mechanics, TU Kaiserslautern, Germany. I have submitted my dissertation on October 2014. And expecting to defend my PhD work on March, 2015.
As part of the 13th US National Congress on Computational Mechanics to be held in San Diego, CA, on July 26-30 2015, it is our pleasure to invite you to submit an abstract to the Symposium “Advances in Computational Methods for Heterogeneous Materials”.
The above minisymposium is organised
at the 11th World Congress on Computational Mechanics in Barcelona
(Spain), July 20 - 25, 2014 (http://www.wccm-eccm-ecfd2014.org/frontal/default.asp).
More details on the minisymposium can be
found in the enclosed PDF by following the link: http://www.wccm-eccm-ecfd2014.org/admin/Files/FileAbstract/A268.pdf
We cordially invite you to participate in the minisymposium "Materials for Extreme Environments: Multi-Scale Experiments and Simulations" at the 50th Society of Engineering Science Annual Technical Meeting (http://www.brown.edu/Conference/ses2013/). The Meeting will be held at Brown niversity, RI, USA during July 28-31, 2013.
We are seeking applicants for a Postdoctoral Fellowship in “stochastic multiscale analysis and design” in the Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. Applicants are expected to have expertise in the following areas: solid mechanics, uncertainty quantification, finite element modeling, and engineering optimization. The candidate is expected to have a strong background in statistical analysis. Prior experience with material microstructure characterization via image processing, and model uncertainty quantification is preferred.