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Minisymposium: Adhesively Bonded Composite Systems- MECHCOMP2014 , NY

skumaar's picture

30th October 2013
- Deadline for submission of abstracts (a text of 4000 characters max.)

Contributions are
invited for a session on Adhesively bonded composite systems (Session
:39),  covering both computational and
experimental aspects of adhesively bonded systems for the 1st  International Conference on Mechanics of
Composites (
MECHCOMP2014) that will be hosted by
Stony Brook University (Long Island, New York). The Conference will take
place from 8-12 June 2014. Topics include but not limited to composite joints,
crack-patch repairs, and bonded electronic assemblies

After the conference, you can submit a full-length
paper for review and possible publication in Composite Structures (an
international journal by Elsevier). 

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