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Active Materials Mini-Symposium, ECCM 6, Glasgow, June 11-15, 2018 (last call)

Submitted by Kostas Danas on

The next European Conference on Computational Mechanics (ECCM - ECFD) will take place from 

June 11th to 15th, 2018, in Glasgow, UK.

It is our pleasure to invite you to participate in our mini symposium:  

MS 58 “Experiments and modeling of smart active materials with electro-  and magneto-mechanical coupling“ (more info here)

The deadline for abstract submission is January 31th, 2018.

Flexoelectricity in Bones: A nanophenomenon that triggers the bone-repair process

Submitted by Amir Abdollahi on

Bones generate electricity under pressure, and this electromechanical behavior is thought to be essential for bone's self-repair and remodeling properties. The origin of this response is attributed to the piezoelectricity of collagen, which is the main structural protein of bones. In theory, however, any material can also generate voltages in response to strain gradients, thanks to the property known as flexoelectricity.

Summer Internship (US Ph.D. candidate of Mechanical / Materials Science and Engineering)

Submitted by Soud Choudhury on

Hi, we are looking for a Summer Intern at the Chandler Site of Intel Corporation. Please, see below the information and contact me if you are a great fit.

Thank you - Soud

Package FA intern

Responsibilities include but are not be limited to:

- EBSD statistical analysis on Cu and solder grain structures and orientation textures;

- Metallography sample preparation for SEM/EBSD observations;

- Work with Physical Failure Analysis teams on electronic packaging failure mechanisms;

Discrete models for concrete mechanics - papers available (free)

Submitted by shavijabranko on

Dear all,

Two papers published by our group dealing with mechanics and transport processes in concrete simulated using discrete (lattice) models are available online for free.

1. Lattice modelling of rapid chloride migration in concrete, at: https://www.researchgate.net/publication/262051929_Lattice_modeling_of_…

Introduction to Simpleware Software Workshop, London, Feb 8th

Submitted by Simpleware on

This workshop is aimed at those interested in obtaining high fidelity models from 3D image data. You will experience first-hand how quick and easy it is to visualize and process 3D image data (CT, MRI, FIB-SEM...), and generate models for CAD design, FE/CFD simulation and 3D printing. If you are working in areas such as Materials Science, Industrial Reverse Engineering and Life Sciences, then this workshop is for you.

Free-to-attend but places limited, so learn more and register now.

Post-doctoral positions at COHMAS-KAUST (UPDATED 1/03/2018)

Submitted by malfano on

===NOTICE: APPLICATION POOL STILL OPEN====

Dear Friends and Colleagues, on behalf of my friends at KAUST, I would like to let you know about two post-doctoral positions in the area of computational mechanics and materials science within the COHMAS Lab at KAUST. Please find attched the calls with detailed description and contacts. BEsts

PhD Opportunity at University of Strathclyde, Glasgow UK - Open to International Students

Submitted by Erkan Oterkus on

Dear All,

 

Applications are invited for a PhD studentship on structural health monitoring at University of Strathclyde under the supervision of Dr Selda Oterkus and Dr Erkan Oterkus. If you are interested, please send your CV to selda.oterkus [at] strath.ac.uk or erkan.oterkus [at] strath.ac.uk

 

Best Regards,

 

2 POSTDOC posts on Computational Solid Mechanics (Delamination modeling) and Functional Nanocomposites/Wearable Electronics

Submitted by dithoap on

The Division of Physical Sciences and Engineering at King Abdullah University of Science and
Technology (KAUST), Saudi Arabia, invites applications for Postdoctoral fellow in Mechanical
Engineering at the Composite and Heterogeneous Material Analysis and Simulation Laboratory
(COHMAS, http://cohmas.kaust.edu.sa).

2 field of studies are available:

Call for Mini-Symposia Proposals for the 2018 EMI International Conference at Tongji University in Shanghai, China

Submitted by Amar A. Chaker on

Prof. Jie LI, Conference Chair, and Prof. Xiaodan REN, Conference Secretariat, invite you, your colleagues and your collaborators to organize a mini-symposium as part of the 2018 EMI International Conference (EMI2018-IC ), which will be held at Tongji University, Shanghai, China, during November 2 - 4, 2018.