Rui Huang's blog

Assignment: Each student completes a term paper of selected topics that (a) addresses a fracture phenomenon in materials or structures, and (b) involves analyses using fracture mechanics. The project contributes 25% of the final grade, distributed as follows:

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EM 388F Lecture Notes 6: Applications of LEFM

Sun, 2008-03-23 11:53 - Rui Huang

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EM 388F Homework Problems 19-23

Sun, 2008-03-23 11:48 - Rui Huang

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EM 388F Homework Problems 9-18

Mon, 2008-03-03 14:35 - Rui Huang

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EM 388F Lecture Notes 5: Fracture Toughness

Mon, 2008-03-03 14:26 - Rui Huang

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EM 388F Lecture Notes 4: Energy Release Rate

Mon, 2008-03-03 14:24 - Rui Huang

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A symposium on Mechanical Instabilities in Polymer Films, Interfaces and Nanostructures

Wed, 2008-02-13 12:41 - Rui Huang

mechanical instability

This symposium is part of the Spring 2008 ACS National Meeting and Exposition , to be held at New Orleans, Louisiana, from Sunday, April 6 to Thursday, April 10, 2008.

Organizers: Christopher M. Stafford (NIST), Adam J. Nolte (NIST), Rui Huang (UT Austin)

Sponsors: ACS Division of Polymeric Materials: Science and Engineering (PMSE) and National Science Foundation

Technical Program:

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EM 388F Homework Problems 5-8

Tue, 2008-02-12 17:57 - Rui Huang

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EM 388F Lecture Notes 3: Stress Intensity Factors

Tue, 2008-02-12 17:40 - Rui Huang

stress intensity factors

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Symposium on Mechanics of Integrated Materials and Structures in Advanced Technologies, at 2008 ASME Congress

Fri, 2008-01-25 12:07 - Rui Huang

conference

asme

Integrated Structures

As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME Applied Mechanics Division (AMD).

When and Where: October 31 - November 6, 2008, Boston, Massachusetts.

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EM 388F Lecture Notes 1-2: Introduction and Elements of Linear Elasticity

Thu, 2008-01-24 16:45 - Rui Huang

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EM 388F Lecture Notes

Thu, 2008-01-24 16:42 - Rui Huang

2. Elements of linear elasticity

3. Stress intensity factors

4. Energy release rate

5. Fracture toughness

6. Applications of LEFM - Practical Issues

7. Mixed mode and interface fracture

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A review on Chip-Package Interaction and Its Impact on Reliability of Cu/low k Interconnects

Thu, 2008-01-17 21:58 - Rui Huang

R. Huang Group Research

microelectronics

X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.

Abstract:

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