reliability

Applications are invited from highly motivated researchers for two postdoctoral positions immediately available in the Multiscale Multiphysics Design Optimisation (M2DO) lab, led by H Alicia Kim.

The international conference is focused on the following topics:

In response to a number of requests, the abstract submission deadline for the EMI 2016 / PMC 2016 Conference at Vanderbilt University has been extended to October 31, 2015.

The event is actually two co-located conferences: the Engineering Mechanics Institute Conference 2016 (EMI 2016) and the Probabilistic Mechanics & Reliability Conference 2016 (PMC 2016). The event wil be chaired by Prof. Sankaran Mahadevan and Prof. Caglar Oskay, both of Vanderbilt University.

 Fuel Cell Ceramics Reliability Summer Intern. 

Interested candidates with a background in mechanical, material science. solid mechanics please email your resume to amit.pandey/at/lgfcs/dot/com with the subject title "Fuel Cell
Ceramics Reliability Summer Intern"

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School of Engineering
LRET Lecturer/Senior Lecturer/Reader in Safety and Reliability Engineering

Reference Number 1231244

Building on a 20-year track record in safety engineering, the School of Engineering at the University of Aberdeen in partnership with The Lloyd's Register Educational Trust (The LRET) is establishing a centre of excellence for research and teaching in the safety and reliability of engineering systems, structures and processes.

Dear Colleagues:

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS and is part of the Micro- and Nano- Systems Engineering and Packaging Track.

The call-for-papers for the symposium is as follows:

Dear Colleagues:

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Tribology of Thin Films and Small-Scale Structures and is part of the Mechanics of Solids, Structures and Fluids Track.

Topic: PhD Fellowship in “Risk
and Reliability of Offshore Wind Turbine Foundations”

Location: NTNU, Trondheim, Norway

Deadline: 09 Mar 2012

Salary: NOK 391 100 to NOK 448
100 per year (equivalent of approximately £43 000 to £50 000)

There are several openings for semiconductor process integration at IBM Microelectronics. The reqiured background is quite broad, specifically mechanical engineering background, reliability, failure analysis and modeling with experience in BEOL process and integration. To see more details and to apply online, please click the link below.

https://jobs3.netmedia1.com/cp/job_summary.jsp?job_id=STG-0424220

The word "failure" can mean different things to different people.  Over the past couple of years, my interactions with various groups from industry has shown me that for some people failure means catastropic fracture/buckling while for others it can mean highly localized plastic yielding.  Even for relatively simple sandwich composite structures, there is no clearly agreed upon definition of the word.

On Aug 10, 2009, Semiconductor International (SI) Newsbreak published a report on my work in AMD about 3D fracture study of underfill delamination as the top story in that issue.  I have never imagined that. Except the pleasure I received from this good news, I wonder if this work is also interesting to iMechanica community.  For that reason, I attach here the SI news report and the original paper published on ITherm2008 Proceedings. Welcome any comments and thoughts.

Reliability
Analysis Associates, Inc.

1440 North Lake Shore Drive, #30F,
Chicago, IL 60610

Phone:
312-274-0542;  Fax: 312-274-0574;  E-mail: reliability@nidus.com

Specializing in
the recruitment of Reliability, Maintainability,

Our agency, Reliability Analysis Associates, Inc., specializes in recruiting Reliability Engineers and related skills.   For a client in the oil business in Houston, TX we are seeking candidates for two positions that require knowlege of finite element analysis, crack growth, reliability, and low cycle fatigue.   The two job descriptions are attached.

X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008. 

Abstract: 

We invite you to participate in the upcoming Workshop on Materials Characterization for Nanoscale Reliability, to take place 14-16 August, 2007 at the University of Colorado in Boulder, Colorado. Details are posted at http://www.boulder.nist.gov/div853/Nanoscale_Reliability_workshop/index.htm.

M.A. Hussein and Jun He (Intel Corporation)

IEEE Transactions on Semiconductor Manufacturing, vol. 18, No. 1, p.69-85, 2005

In this work, we explain how the manufacturing technology and reliability for advanced interconnects is impacted by the choice of metallization and interlayer dielectric (ILD) materials. The replacement of aluminum alloys by copper, as the metal of choice at the 130nm technology node, mandated notable changes in integration, metallization, and patterning technologies. Those changes directly impacted the reliability performance of the interconnect system. Although further improvement in interconnect performance is being pursued through utilizing progressively lower dielectric constant (low-k) ILD materials from one technology node to another, the inherent weak mechanical strength of low-k ILDs and the potential for degradation in the dielectric constant during processing, pose serious challenges to the implementation of such materials in high volume manufacturing. We will consider the cases of two ILD materials; carbon-doped silicon dioxide (CDO) and low-k spin-on-polymer to illustrate the impact of ILD choice on the process technology and reliability of copper interconnects. preprint pdf 2.49 MB