The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.

As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME Applied Mechanics Division (AMD).

When and Where: October 31 - November 6, 2008, Boston, Massachusetts.

Abstract submission deadline: March 3, 2008 

H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).

Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.

First, instead of using the approximate formula by Ye, Suo and Evans (1992), we calculate the energy release rate of interfacial delamination emanating from the channel crack exclusively by the finite element method. We found that the approximate formula is not accurate in several cases.

Attached slides were presented at the 2007 ASME Congress at Seattle.

At the 2007 ASME Applied Mechanics and Materials Conference (McMat 2007)

June 3-7, 2007, Austin, Texas

In response to a proposal by Zhigang Suo in November 2005, the Executive Committee of the Applied Mechanics Division (AMD) of ASME has created a new Technical Committee on Integrated Structures. The main purpose is to provide a home at AMD for those who are working in the interdisciplinary areas involving applied mechanics and integrated materials/structures such as microelectronics and biomedical technologies. Read more here.

To forge the link between academia and industries, the committee will be co-chaired by industrial and academic members. For the first year, Jun He of Intel and Rui Huang (myself) have served as the co-chairs. As the 2006 ASME Congress (November 5-10) coming around the corner, we would like to draw your attention to our first activities at the congress.