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Call for Book chapters to be published by CRC Press (Taylor & Francis Group)

Submitted by Anonymous (not verified) on

We are inviting chapters for our proposed book on “Smart Technologies for Improved Performance of Manufacturing Systems and Services”.

 

To be published by CRC Press (Taylor n Francis Group), USA; Book series: Advances in Intelligent Decision-Making, Systems Engineering, and Project Management.

 

MULTISCALE MECHANICS, MULTIPHYSICS MODELING AND SIMULATIONS FOR ENERGY STORAGE

Submitted by Anonymous (not verified) on

 

Dear Colleagues,

The Programme of the Euromech Colloquium “MULTISCALE MECHANICS, MULTIPHYSICS MODELING AND SIMULATIONS FOR ENERGY STORAGE” to be held in Sirmione, Italy, 29-31 August, 2022 ( https://617.euromech.org/ ) has been finalized and is attached. 

Plenary lectures will be offered by, in alphabetical order :

3rd International Workshop on RELIABILITY AND DESIGN OF ADDITIVELY MANUFACTURED MATERIALS - RdAMM22

Submitted by Roberto Brighenti on

Faculty of Mechanical Engineering, Univ. of Belgrade, Serbia

4th - 6th October 2022

the Workshop will be held in presence & online

Participation in the Workshop is free (a limited number of places is available) - International Workshop website

Book of Abstracts, journal publication, lunches, and Coffee breaks are included!

CALL FOR PAPERS: EVOLUTIONARY MANUFCTURING, DESIGN AND OPERATIONAL PRACTICES FOR SUSTAINABILITY

Submitted by Anonymous (not verified) on

 

Authors are kindly requested to submit an abstract of no more than 300 words in English. The abstract should state clearly the objective of this work, results, and a brief conclusion. The title of the paper, authors’ name and affiliations, full address, and phone number, fax number, as well as email address of the corresponding author should be included. This conference is dedicated to recent developments in transforming industry through digitalization for environmental and operational sustainability. The topics includes (not limited) to:

Call for Book Chapters Digital Technology Enabled Circular Economy: Models for Environmental and Resource Sustainability

Submitted by Anonymous (not verified) on

Chapters to be covered in this book includes (but not
limited to) the following themes:
 AI, IoT and BDA powered CE models to evaluate and optimize performance of waste management systems.
 Applications of deep learning and unsupervised feature
learning for prediction of sustainable feature smart transportation system
 Application of DT and CE technologies for Sustainable design of distributed energy supply systems
 Digital Technology-enabled circular economy for sustainable production and consumption
 Frameworks to Evaluate the Influence of DT and CE-based

Call for Abstracts - Topic 12-12 Mechanical Metamaterials @ 2022 IMECE

Submitted by Joshua on

Topic 12-12: Mechanical Metamaterials

Organized by

Jordan Raney, University of Pennsylvania, USA, raney [at] seas.upenn.edu (raney[at]seas[dot]upenn[dot]edu)

Jaehyung Ju, Shanghai Jiao Tong University, China, jaehyung.ju [at] sjtu.edu.cn (jaehyung[dot]ju[at]sjtu[dot]edu[dot]cn)

Call for Book Chapters of Our Proposed Book on “Smart Technologies for Improved Performance of Manufacturing Systems and Services"

Submitted by Anonymous (not verified) on

Dear Professor,

 

We are inviting chapters for our proposed book on “Smart Technologies for Improved Performance of Manufacturing Systems and Services”.

 

To be published by CRC Press (Taylor n Francis Group), USA; Book series: Advances in Intelligent Decision-Making, Systems Engineering, and Project Management.

 

Experimental Mechanics of Thin Films & Multilayers

Submitted by Aman Haque on

Colleagues: Please consider submitting an abstract to the symposium, "Thin Films and Multilayers: From Microstructure to Device Characteristics" to take place in Porto, Portugal, 2-7 July, 2023. Please let me know if you have any questions.

Topical areas: 

• Film thickness and microstructure effects on elasticity, plasticity, fracture and fatigue as well as electrical and dielectric properties

• Strain/light/magnetic field engineering of sensors, electronics

• Mechanics of multi-layered systems (from thermal barrier coating to microelectronics)