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Call for Abstract Submission to the EMI 2023 Symposium on "Modeling of Materials with Interfaces and Scales Using Physics-Based and Machine-Learning
Dear Colleagues,
We wish to invite you to present your work in a mini-symposium we are organizing in the 2023 Engineering Mechanics Institute Conference (EMI), entitled "Modeling of Materials with Interfaces and Scales Using Physics-Based and Machine-Learning Methods". The upcoming EMI conference is planned to be held at Georgia Tech in Atlanta, GA, June 6-June 9, 2023. Our mini-symposium aims to provide a forum for discussing novel computational methods and their applications that pertain to mechanics of materials and structures. Contributions on the following topics are of significant interest:
· Multiscale modeling and methods for heterogeneous materials including composites, earth materials, and others.
· Novel formulation and algorithm development for solids and materials, including interfacial FEM, phase field fracture, contact/friction, and other engineering problems.
· Computational methods for time dependent material response (crystal plasticity, creep, fatigue, etc.).
· Application of deep learning in predicting the mechanical behavior of materials.
· Model order reduction techniques and surrogate modeling for accelerating multiscale analysis.
We believe your research is closely related to the topics listed above and enthusiastically look forward to your contribution to our session. Please note that the deadline for abstract submission is Jan. 15th, 2023. You can submit your abstract using the following link (our session is listed as symposium 309):https://www.emi-conference.org/program/call-abstracts
We hope you can join us in the EMI conference and look forward to seeing you in Atlanta.
Best wishes,
Xiang Zhang, University of Wyoming
Pinlei Chen, Pennsylvania State University
Ravindra Duddu, Vanderbilt University
Soheil Soghrati, The Ohio State University
Timothy Truster, The University of Tennessee
Reza, Abedi, The University of Tennessee, Space Institute
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