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SES Symposium 8.9 - Mechanics, Materials, Manufacture and Device Innovations of Soft Electronics - Abstracts Due Monday May 16

Yihui Zhang's picture

Dear Colleagues, 

We are organizing a symposium “Mechanics, Materials, Manufacture and Device Innovations of Soft Electronics” (Symposium 8.9) at the SES 2022 Annual Meeting (October 16-19) at College Station, TX. The aim of this symposium is to offer a forum to foster knowledge exchange and discussions on the latest advances in the fast-growing broad field of soft, flexible and stretchable electronics, sensors, and integrated systems for a wide range of applications, including but not limited to biomedicine, robotics, space, human-machine interaction, and agriculture. Both fundamental research in mechanics, materials, manufacture, device innovations, as well as practical applications of flexible and stretchable electronics are welcome.  

We would like to encourage you and your students to submit an abstract by the Monday May 16 deadline. Further details and abstract submissions can be found here:

https://na.eventscloud.com/website/33592/home/

 

Sincerely,  

Cunjiang Yu, Penn State University

Limei Tian, Texas A&M University 

Yihui Zhang, Tsinghua University

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