I am interested in measuring the adhesive energy (debond energy; Turner et al., Acta metall.mater., 43, 3459, 1995) of resin/metal interfaces and am considering several different sample geometries such as the DCDC sample and the double cantilever beam sample. Of course both the resin and metal (e.g., copper) are “ductile” so the situation is different from that for ceramic/metal interfaces. I would like to obtain more reliable numbers for the “adhesive energy” than one might obtain from a simple peel-type test. I am trying to determine if someone has any insights in to the best type of sample configuration for this problem. Thanks in advance for any suggestions.
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Re: adhesive/debond energy
Dear Karl: Have you seen this paper?
S-Y. Kook and R. H. Dauskardt, “Moisture-Assisted Debonding of a Polymer/Metal Interface,” Journal of Applied Physics, 91 [3], 1293-1303, 2002.
adhesive/debond energy
Dear Zhigang: Thanks very much for the reference to the Kook and Dauskardt paper. I had not seen it and it has been very helpful!