Blog posts

Position starting at the beginning of 2015, in LIMATB (France) - http://www-limatb.univ-ubs.fr - on the subject: Modeling plastic instabilities (PLC type) developing under various strain paths

Dear Friends,
Let me assure you that we (the editorial team) are just as anxious as you are to see what kind of papers are published by EML, with similar anticipation as one looks at a new born baby for the first time.  Does the baby girl have big eyes like her mother? Or does the baby boy have little hair on his head like his father? Or the baby is just different, different from all other children, and beautifully so.

Peace be upon you everybody;

We report a novel optical microscope for full-field, noncontact measurements of three-dimensional (3D) surface deformation and topography at the microscale. The microscope system is based on a seamless integration of the diffraction-assisted image correlation (DAIC) method with fluorescent microscopy. We experimentally demonstrate the microscope’s capability for 3D measurements with submicrometer spatial resolution and subpixel measurement accuracy.

Dear Colleagues,

One proposes a new background of micromechanics defining a new field of micromechanics called computational analytical micromechanics (CAM, see the abstract attached). It offers opportunities for a fundamental jump in multi-scale and multi-physics modeling of random heterogeneous media with drastically improved accuracy of local field estimations.  I would be happy if you pay your attention to CAM.

Valeriy Buryachenko

Here is the number of 2014 papers published in JAM from each country and region.

79 -- USA;

45 -- China (including Hong Kong);

9 -- Canada;  

5 -- Singapore;

4 -- Italy; Japan; 

3 -- France; India; Russia; UK;

2 -- Germany; Israel; South Korea;

1 -- Iceland; Iran; Netherlands; Spain; Sweden; Switzerland; Taiwan.

Applications are invited for one PhD and one postdoc positions in the area of computational mechanics of materials, at Delft University of Technology, in the Netherlands. See the attached file for details.