ASME 2015 International Technical Conference and Exhibition on Packaging (InterPACK 2015) will be in the Fairmont San Francisco Hotel, San Francisco, California from July 6-9, 2015. You are invited to submit paper to the topic on Advances in Interconnect Technologies at the InterPACK 2015. Please see the attachment of call for paper and note the abstract deadline of Dec. 8, 2014.
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| 3-Advances in Interconnect Technologies Topic CFP-Final.pdf | 175.53 KB |
interPACK 2015
Are you interested to go to the conference? Good new! The deadline for abstract submission is extended to December 22. You are invited to submit a paper as soon as possible.