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Announcing the 25th International Conference on Wear of Materials

Submitted by Sophie Hayward on

 

We are delighted to announce that the 25th International Conference on Wear of Materials will take place in the beautiful Sitges, Spain from 13-17 April 2025.

The International Conference on Wear of Materials is a prestigious, long-established conference which provides a unique international forum for researchers and practicing engineers from different disciplines to interact and exchange their latest results. It is unique for its paper submission process with full peer review in collaboration with the Elsevier journal Wear to ensure the technical quality of presentations.

This special 25th edition of the conference will include sessions on both the fundamental and applied aspects of the wear of materials, including special related topics in aerospace, renewable energy, e-vehicles, biotribology, tool wear, and surface engineering. 

We welcome both experimental and modeling work in format of full length research paper or case study with focus on wear of materials. A full list of topical areas are listed below. 

Oral and poster abstracts are now invited on the following topics and should be submitted using the online abstract submission system. Deadline: 7 June 2024

Conference Topics:

  • Biotribology
  • Ceramics and CMCs
  • Cutting and Tool Wear
  • Erosion and Erosion-Impact
  • Extreme Environment Wear including High and Low Temperatures and Vacuum 
  • Fretting Wear
  • Lubricated Wear
  • Metals and MMCs
  • Polymers and PMCs, Friction Materials
  • Role of Third Bodies
  • Rolling Wear including Bearing, Gear, and Rail
  • Sliding Wear including scuffing and galling
  • Surface Engineering including Coatings, Surface Treatment, Surface Texturing
  • Transportation Wear including Automotive, Aerospace, and Marine 
  • Tribocorrosion including erosion-corrosion
  • Wear in Renewable and Sustainable Technologies
  • Wear Testing and Monitoring
  • Emerging topics

We look forward to receiving your submission.

Kind regards,

Conference Chair
Richard Chromick, McGill University, Quebec, Canada