This is a friendly reminder to draw your attention to the Symposium on **Soft Materials and Structures** to take place at the upcoming 51th Meeting of the Society of Engineering Sciences (SES) at Purdue University, West Lafayette, IN (Oct 1-3, 2014). More information can be found on the meeting's website:
Over the past few years, soft materials and mechanical structures based
on soft materials have driven our community into new exciting
directions. Large deformations and instabilities of soft materials and
structures can be immensely rich, albeit nontrivial. As a result, they
offer unique opportunities to design multifunctional materials and
devices with novel properties, through the appropriate design of
material composition and structural layout. The mini-symposium will
address recent experimental, computational, theoretical and
manufacturing advances in this direction. Topics of particular interest
include:
- Electroactive and magnetoactive elastomers
- Liquid crystal elastomers
- Shape-memory and light-sensitive polymers
- Responsive gels and Ionic Polymer-Metal Composites (IPMC)
- Soft structures including rods, plates, shells and biological structures
- Geometric and material instabilities
- Foldable and deployable structures
- 3D printing of soft materials and structures
The deadline for receipt of abstracts is Wed, April 30, 2014. Abstracts can be submitted using the following link:
Please select Soft Materials and Structures as the primary subject area under the track of Mechanics of Solids and Structures to ensure allocation to the correct session.
Xuanhe Zhao, Duke University
xz69 [at] duke.edu (xz69[at]duke[dot]edu )919-660-5541
Pedro Reis, Massachusetts Institute of Technology
preis [at] mit.edu (preis[at]mit[dot]edu)
xz69 [at] duke.edu
Katia Bertoldi, Harvard University
bertoldi [at] seas.harvard.edu (bertoldi[at]seas[dot]harvard[dot]edu)
Oscar Lopez-Pamies, University of Illinois at Urbana-Champaign
pamies [at] illinois.edu (pamies[at]illinois[dot]edu)
Stephen Rudykh, Massachusetts Institute of Technology
%20rudykh [at] mit.edu (Subject: SES%202014%20Conference) (
rudykh[at]mit[dot]edu)