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Sr. Packaging Mechanical Analyst at Apple

Jie-Hua Zhao's picture

 Sr. Packaging Mechanical Analyst

  • Job Number: 25557504 
  • Santa Clara Valley, California, United States
  • Posted: Jan. 3, 2013
  • Weekly Hours: 40.00

Job Summary

Mechanical engineer working in the central IC packaging group.

Key Qualifications

  • Expert in FEA and solid mechanics. Proficent in using Ansys and APDL. Working knowledge in advanced packaging including flip chip, wirebond, stack die and TSV. Strong background in material modeling including solder, polymer based materials. Familiar with heat transfer and multiphysics. Strong coding skills in C++, Fortran, Python, Matlab or Mathematica.
  • Team player. Energetic, self driven and can work under high pressure. Excellent communication skills are must.


Develop FEA models for IC packaging/sensor and subsystems including stress, deflection, fatigue and fracture behaviors. Key player in advanced packaging development by providing support on material modeling & characterization, reliability modeling, mechanical testing and measurement. Drive vendors on modeling methodology development, calibration, measurement.


Minimum MS in Mechanical engineering or related engineering disciplines with 3+ years industry experience. 


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