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Postdoctoral Position in Mechanics of Soft Materials/Flexible Electronics/Adhesion

Submitted by Harley T. Johnson on

A postdoctoral position is available starting immediately in the Johnson Research Group at the University of Illinois at Urbana-Champaign.  The position will involve theoretical and computational modeling of the mechanics of soft materials/flexible electronics/adhesion, with applications in photonics and energy storage.  The work will involve significant interactions with experimental groups in the Department of Materials Science at the University of Illinois.  Applicants should send a CV with a list of references to htj [at] illinois.edu (htj[at]illinois[dot]edu).

Respected Sir(Prof. Harley T. Johnson):

I am Hemaraju Pollayi pursuing PhD(Expected Graduation Date:
August 2010) at Aerospace Engineering, Indian Institute of
Science-Bangalore and working with Dr. Dineshkumar Harursampath(PhD,
Georgia Tech).

Could You please tell me if You have any position available for a post-doctoral research fellowship ?

I am very happy if You take Me as a post-doctoral research fellow.

I have forwarded My CV to Your E-mail: htj [at] illinois.edu

Thanking You Sir

Yours Sincerely,

 raju.



Regards

================

Hemaraju Pollayi

Graduate Student(PhD Scholar)

Thesis Advisor: Dr. Dineshkumar Harursampath(PhD, GeorgiaTech)

                Founder-Director of NMCAD Lab

Nonlinear Multifunctional Composites Analysis and Design Lab(NMCAD Lab)

AR&DB Centre of Excellence in Composites Structures Technology(ACECOST)

Department of Aerospace Engineering

Indian Institute of Science

Bangalore - 560012, Karnataka, INDIA



E-Mail: pollayi_hemaraju [at] yahoo.com     

        pollayi.hemaraju [at] gmail.com

 

Sat, 05/15/2010 - 11:30 Permalink