Dear colleagues,

We would like to invite you to submit an abstract to a Symposium on Mechanics of Integrated Structures and Materials in Advanced Technologies at the ASME 2012 IMECE, to be held Nov 9-15, 2012, at Houston Texas. This symposium will be the seventh in such a symposium series organized by ASME Technical Committee of Integrated Structures since IMECE 2006. We hope you can join us and continue the success of this symposium series.

Deadline of abstract submission is Monday, 27 Feb. 2012.

Topics of interests include, but not limited to the following areas: 

We perform uniaxial tensile tests on polyimide-supported copper films with a strong (111) fiber texture and with thicknesses varying from 50 nm to 1 μm. Films with thicknesses below 200 nm fail by intergranular fracture at elongations of only a few percent. Thicker films rupture by ductile transgranular fracture and local debonding from the substrate. The failure strain for transgranular fracture exhibits a maximum for film thicknesses around 500 nm. The transgranular failure mechanism is elucidated by performing finite element simulations that incorporate a cohesive zone along the film/substrate interface.

An electronic device integrates diverse materials, and inevitably contains sharp features, such as interfaces and corners. When the device is subject to thermal and mechanical loads, the corners develop intense stress and are vulnerable sites to initiate failure. This paper analyzes stress fields at corners in flip-chip packages. The stress at a corner is a linear superposition of two modes of singular fields, with one mode being more singular than the other. The amplitudes of the two modes are represented by two stress intensity factors of dissimilar dimensions. To determine the stress intensity factors, we analyze the flip-chip structures under two loading conditions: stretching of the substrate and bending of the substrate.

In a previous paper , we have demonstrated that a microcrystalline copper film well bonded to a polymer substrate can be stretched beyond 50% without cracking. The film eventually fails through the co-evolution of necking and debonding from the substrate. Here we report much lower strains to failure (around 10%) for polymer-supported nanocrystalline metal films, whose microstructure is revealed to be unstable under mechanical loading.

SERC launched the A*STAR Investigatorships last year. This prestigious award for top young research talent, tenable at their research institutes, aims to nurture young talent and build R&D capabilities in Singapore.

This year, the award is open for applications in the following areas:

The Singapore International Graduate Award (SINGA) is a collaboration between the Agency for Science, Technology & REsearch (A*STAR), the National Unviersity of Singaproe (NUS) and the Nanyang Technological University (NTU). PhD training will be carried out in English at your chosen lab at A*STAR Research Institutes, NUS or NTU. Students will be supervised by distinguished and world-renowned researchers in these labs. Upon successful completion, students will be conferred a PhD degree by either NUS or NTU.

Applications

To apply, please go to https://www.singa.a-star.edu.sg/ to access the SINGA application form, and note the application deadlines.

This is the last problem set this semester. It is due on Friday, Dec. 14, 2007.

See attachment for ES 240 lecture notes on plasticity.

See attachment for ES 240 lecture notes on viscoelasticity.

This problem set is due Friday, Dec.7, 2007.

ES 240 notes for Bending of plates is attached.

This problem set is due Monday, Nov.26, 2007.

This computer assignment is due Friday, Nov. 16, 2007

Please download and read the following materials.
 

1-1 ABAQUS tutorial for ES 240.pdf

1-2 Learning ABAQUS.pdf    

1-3 CAE Example.pdf

ES 240 notes for Principle of virtual work and FEM. Please see attached.

This problem set is due on Nov.2, 2007.

Part 2 of Plane Elasticity notes. Please see attached.

This Problem Set is due on Friday, Oct. 26. 

U.S. National Committee on Theoretical and Applied Mechanics
Announces
 
Travel Fellowships to ICTAM 2008

This problem set is due on Friday, Oct. 19

Part 1 of Plane Elasticity notes. Please see attached.

Part 4 of Elements of Elasticity. Please see attached.

This problem set is due on Friday, Oct. 12.

To all students in ES 240 this semester,

Due to popular demand my office hour is moved from Tuesday to Thursday 4~5pm starting from this week. The location is changed to Rm. 123, Maxwell Dworkin (33 Oxford Street).

Nanshu

This problem set will be due on Friday, Oct. 4th.