The Mach Conference showcases the state of the art of multiscale research in materials, with an emphasis on advancing the fundamental science and engineering of materials and structures in extreme environments.
Abstracts are due January 6, 2014. For more information, please go to the conference website machconference.org.
Jim Barber and I just got accepted this paper in JMPS, and it is also already available on Arxiv. We found a remarkably simple closed form solution for adhesion on orthotropic materials in the planes of symmetry. This shows adhesion can increase significantly due to anisotropy, namely the JKR solution continues to hold in the sense of mean elastic modulus, but the prefactor can grow without limit. We expect applications in crystals indentation, but also in locomotion in biological world.
The above minisymposium is organised
at the 11th World Congress on Computational Mechanics in Barcelona
(Spain), July 20 - 25, 2014 (http://www.wccm-eccm-ecfd2014.org/frontal/default.asp).
The 2014 EMI Conference will take place on August 5-8, 2014 at
McMaster University in Hamilton, Ontario and will be chaired by Prof. Samir E.
Chidiac, Ph.D. P.Eng., Department of Civil Engineering. The conference
will focus on “Mechanics for Sustainable and Resilient Systems”, a theme
of interest to participants from the disciplines of civil engineering,
mechanical engineering and engineering physics.
International Conference on Fatigue Damage of Structural Materials - Submit your abstract by 13 December 2013!Submitted by Sophie Hayward on Mon, 2013-12-09 08:20.
Internship/Studentship position: Application of full field measurement to the identification of composite materialsSubmitted by Wuf on Mon, 2013-12-09 07:01.
A studentship opportunity is available at COHMAS within the framework of a research project related to the rapid and online identification of specific composite materials. The candidate will have to design a short experimental campaign to meet specific constraints, to conduct testing and full field measurement on these configuration and to get familiar with classical inverse problem procedures. Prospective candidate students will be exposed to a truly multidisciplinary work, involving topics in materials science and solid mechanics; in addition, he/she will participate in scientific outreach activities.
This subject can be followed by a PhD offer depending on the outcomes of the internship.
Internship/Studentship position: Mechanical properties of new integrated flexible electronics based on RGO doped thermoplasticsSubmitted by Wuf on Mon, 2013-12-09 07:00.
A studentship opportunity is available at COHMAS within the framework of a research project related to future flexible electronics. These are usually made of a transparent electrode (ITO) deposited on a polymer substrate. Such design results in loss of integrity when cracks develop in the thin brittle electrode. This projects intends to characterize mechanical properties of new solution for which the electrode and the substrate are merged together into a single active layer. The project will cover fatigue dependent properties as well a piezoresistive effects. Prospective candidate students will be exposed to a truly multidisciplinary work, involving topics in materials science and solid mechanics; in addition, he/she will participate in scientific outreach activities.
Internship/Studentship position: Adhesion phenomena across interfaces with spatially heterogeneous adhesive propertiesSubmitted by Wuf on Mon, 2013-12-09 06:59.
A studentship opportunity is available at COHMAS within the framework of a research project related to adhesion phenomena across interfaces with spatially heterogeneous adhesive properties. The project aims to explore the effect of heterogeneities on the mechanical behavior of bonded interfaces through integrated experiments and simulations. The research seeks to systematically design multiple sites of potential crack pinning across the interface, able to trigger sequential events of initiation, propagation and crack arrest, thus promoting macroscopic variations of strength and toughness. Inspiration in the search for such novel material configurations is derived from those observed in nature.
The Division of Physical Sciences and Engineering at King Abdullah University of Science and Technology (KAUST) invites applications for a Postdoctoral fellow in Mechanical Engineering at the Composite and Heterogeneous Material Analysis and Simulation Laboratory (COHMAS, http://cohmas.kaust.edu.sa).
We seek highly motivated candidates who will be involved in a challenging project on full-field measurement based local identification of material properties, with applications to composite materials. The main objective will be to improve the robustness and confidence in image correlation (2D/3D) for recovering heterogeneity of material properties in large parts of industrial complexity and in very refined low scale microstructures.
Journal Tittle: Advances in Mechanics
Strain gauges are widely used across all engineering fields to measure mechanical deformation of a solid object. The most common type of strain gauges consists of a patterned metal foil on a stiff plastic backing sheet glued to the solid object. Deformation in the object leads to deformation in the foil, thereby causing its electrical resistance to change. The fractional change in resistance, ΔR/R0, is related to the mechanical strain by the gauge factor (GF): GF = (ΔR/R0)/ε. The GF for metallic foils are typically between 2 to 5 , due mostly to changes in length and cross-sectional area. Compared to metallic foils, semiconductor devices can exhibit much larger GF due to piezoresistive effects  where the resistivity changes rapidly with strain due to the dependence of the bandgap on inter-atomic spacing. For example, the gauge factor of p-type  single crystalline silicon can be as high as 200 . As a result, for precision measurements, semiconductor gauges, also called piezoresistors, are preferred over metal foils. These types of devices are widely used as ‘hard’ sensors attached to stiff materials such as metals, concretes and high modulus plastics for structural health monitoring or quantifying specimen deformation.
I would like to share with fellow mechanicians an educational iPad app I recently developed. The name of the app is Truss Me! and the main goal is to help students, all the way from high school to college, to build intuition on how truss structures behave. The video below highlights some features of the app:
The app utilizes state of the art simulation techniques to provide
Deadline extended: Call for abstracts and special issue papers: Computational mechanics of cells, tissues, and biomaterialsSubmitted by azadpoor on Fri, 2013-12-06 06:04.
We would be pleased to have a contribution from you or from one of the
members of your group among the presentations of the symposium entitled
COMPUTATIONAL MECHANICS OF CELLS TISSUES AND BIOMATERIALS
organized within the joint World Congress on Computational Mechanics and European Conference on Computational Mechanics (http://www.wccm-eccm-ecfd2014.org/frontal/default.asp )
to be held on 20-25 July 2014 in Barcelona (Spain).
Ying Li, Wylie Stroberg, Tae-Rin Lee, Han Sung Kim, Han Man, Dean Ho, Paolo Decuzzi, Wing Kam Liu
Dr. Steven Kurtz, Exponent, Inc., and Drexel University, USA will be the Plenary Speaker at ICoBT2014
Keynote Speakers include:
Dr. Siegfried Derler, EMPA, Switzerland
Professor Jeremy Gilbert, Syracuse Biomaterials Institute, USA
Dr. Jason Stokes, The University of Queensland, Australia
Professor Yu Tian, Tsinghua University, China
I was reading the Bernard Shutz's book on Geometrical Methods in Mathematical Physics. It is an excellent book on the subject; however there should exist an auxiliary source whenever it is needed. I wonder where I can find more information about Fiber Bundles and their applications in mathematical physics.
Symposium: "Validated Materials Modeling with Quantified Uncertainties Across Scales and Physics" at WCCM-14 in Barcelona, SpainSubmitted by Jaime on Tue, 2013-12-03 19:43.
The 11th World Congress on Computational Mechanics will be held 20-25 July 2014 in Barcelona, Spain.
We cordially invite you to submit an abstract to present your work in the minisymposium “Validated Materials Modeling with Quantified Uncertainties Across Scales and Physics” at http://www.wccm-eccm-ecfd2014.org. A detailed description of the minisymposium is attached below. The deadline for the abstract submission is December 15, 2013.
Please fee free to forward this information to colleagues who might be interested in attending.
KAUST (King Abdullah University of Science and Technology)
Open Position as Optoelectronics Lab Engineer
Competitive Tax-free Salary
Just to let you know that we are making a call for papers for the minisymposium Computational Techniques and Simulation of ....Submitted by jlcurie on Tue, 2013-12-03 07:22.
The Multiscale Design Systems, LLC (http://www.multiscale.biz/) has an opening for a Multiscale Scientist position in multiscale modeling and simulation of composites and metals.
Required qualifications for this positions are as follows:
1. A PhD degree mechanics or related engineering discipline.
2. Strong background in solid mechanics, finite elements, multiphysics and multiscale modeling.
3. Proficiency in Fortran, C, C++ and established record in code development.
4. Provide Technical Leadership.
5. Good communication skills.
A postdoctoral research positions is open for application
An enthusiastic and highly motivated postdoctoral scientist is sought to work on water desalination using nanostructured membranes at Nanyang Technological University, Singapore.
The candidates should have rich experiences in relevant research areas, good publication records, and excellent writing skills. Preference will be given to those with experience in molecular dynamics simulation. The contract will be one year and renewable subject to performance.
The Uniaxial Tensile Response of Porous and Microcracked Ceramic Materials
Amit Pandey,§,*,†,‡ Amit Shyam,§,* Thomas R. Watkins,§,* Edgar Lara-Curzio,§,** Randy J. Stafford,¶,* and Kevin J. Hemker||