History

Blog

View recent blog entries

Member for

1 year 45 weeks

My profile

Full name

Dhruv Bhate

Role in iMechanica

Moderator

URL of homepage

http://meweb.ecn.purdue.edu/~dbhate/

Job function

Engineer

Job sector

Industry

Company or institution

Intel Corporation

Title of group

Process Technology Development

Doctoral thesis advisor

Ganesh Subbarayan

My resume

Resume

INTERESTS

Applied Mechanics (Experimental and Numerical)
· Experimental characterization of material behavior and failure processes
· Finite element analysis, development of constitutive and failure models

Theoretical Mechanics and Materials Science
· Continuum and Fracture Mechanics
· Failure and microstructural analysis of materials
________________________________________________________________________________________________________________________________

EDUCATION

PURDUE UNIVERSITY, West Lafayette, IN 05/2004 - present
Doctor of Philosophy, Mechanical Engineering, December 2007 (GPA: 3.90/4.00)
· Thesis: A Unified Approach to Modeling Fracture in Ductile Materials: Constitutive- and Failure Models for SnAgCu Solder Alloys
· Ross Doctoral Fellowship awarded by Graduate School, 2004-05
· Relevant Coursework: Fracture Mechanics, Continuum Mechanics, Nonlinear Mechanics, Finite Element and Boundary Element Methods, Plasticity Theory, Integrated Circuit and MEMS Fabrication Lab, Micromechanics of Materials, Defects in Solids, Quantitative Analysis of Microstructure

UNIVERSITY OF COLORADO, Boulder 08/2001 – 05/2003
Master of Science, Mechanical Engineering, May 2003 (GPA 3.97/4.00)
· Thesis: Adhesion of Thin Film Microstructures: Modeling and Measurements
· Relevant Coursework: Electronic Packaging and Manufacturing, Microelectromechanical Systems (MEMS)

UNIVERSITY OF PUNE, India 08/1997 – 05/2001
Bachelor of Engineering, Mechanical Engineering, August 2001 (First Class with Distinction)
________________________________________________________________________________________________________________________________

WORK EXPERIENCE

Purdue University, West Lafayette, IN 05/2004 - present
Graduate Research Assistant
· Developed fracture models for SnAgCu solder joints and implemented in commercial finite element software
· Formulated constitutive models for SnAgCu solder alloys via experimental characterization and numerical regression in MATLAB
· Designed and setup anisothermal cycling tester to characterize fatigue failure in microelectronic packages
· Implemented INSTRON tensile testing equipment, capacitance sensor and DAQ system for material characterization

INTEL Corporation, Chandler, AZ Summer 2005
Intern
· Implemented test methodology for BGA solder interconnections at strain rates comparable to those seen in impact testing
· Extensive use of MTS testing systems, DAQ systems and ABAQUS finite element modeling

INDIANANO, Pune, India 09/2003 – 04/2004
Technology Associate
· Evaluated emerging nanotechnologies and assessed market potential for commercialization in India

TATA Motors, Pune, India 01/ - 07/2001, 06/ - 12/1999
Undergraduate Co-op
· Design, manufacture, testing and installation of Automatic Gear Deburring Machine to obtain gear noise reduction and smoother shifting in automotive transmissions via superior finishing processes
· Trained in industry processes including CNC programming
______________________________________________________________________________________________________________________________

TEACHING EXPERIENCE

Purdue University, West Lafayette, IN 01/ - 05/2007, 01/ - 05/2006
Teaching Assistant (Course: Reliability Based Design)

Center for International Education, IMS, Pune, India 08/2003 - 04/2004
Instructor (part time) in Mathematics for GMAT and GRE test prep

University of Colorado, Boulder
Lead Graduate Teacher, Mechanical Engineering 08/ - 12/2002
· Liaison between faculty and teaching assistants in department
Teaching Assistant (Courses: Circuits and Electronics, Materials Science, System Dynamics) 08/2001 - 12/2002
________________________________________________________________________________________________________________________________

SKILLS
· Numerical Tools: ABAQUS, ANSYS, Matlab, Mathematica, AutoCAD, FORTRAN, I-DEAS-FEA, DASYLab
· Material Characterization Techniques: INSTRON and MTS tensile testers, Scanning Electron Microscopy (SEM), DAQ systems, Capacitance Sensors, Digital Image Correlation (DIC)
· Micro-Fabrication Techniques: Photolithography, device characterization
· Fluent in English, German, Hindi and Marathi
________________________________________________________________________________________________________________________________

PUBLICATIONS
Peer Reviewed Journal Publications
· D. Bhate, M. Dunn, “Adhesion of Arbitrary Shaped Thin Film Microstructures,” in press, Journal of Microelectronics Reliability (Mar 2007)
· D. Bhate, D. Chan, G. Subbarayan, T.C. Chiu, V. Gupta, D. Edwards, “Creep and Low Strain Rate Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys: Development of Valid Constitutive Models,” accepted for publication in IEEE Transactions on Components and Packaging Technologies (Jan 2007)
· D. Bhate, P. Towashiraporn, G. Subbarayan, “A Weibull failure perspective on cohesive zone models for predicting failure in ductile materials,” in press, Journal of Electronic Packaging (Jan 2007)

Selected Conference Proceedings and Presentations
· D. Bhate, D. Chan, G. Subbarayan, L. Nguyen, "Fatigue Crack Growth and Life Descriptions of Sn3.8Ag0.7Cu Solder Joints: A Computational and Experimental Study ," to be presented at 2007 Electronics Components and Technology Conference (ECTC), Reno, NV, May 30- June 01, 2007
· M. Dunn, K. Maute, F.W. DelRio, D. Bhate, K. Sylves, C.R. Stoldt, M. Derkey, "Adhesive Micro/nanostructures: Modeling, Design, and Fabrication," 2006 NSF Design, Service, and Manufacturing Grantees and Research Conference, St. Louis, Missouri, July 24-27, 2006
· D. Bhate, P. Towashiraporn, G. Subbarayan, "A Weibull Failure Perspective on Cohesive Zone Models for Predicting Fatigue Failure in Ductile Materials," presented at the 7th World Congress on Computational Mechanics, Los Angeles, California, July 16-22, 2006
· D. Bhate, D. Chan, G. Subbarayan, T.C. Chiu, "Solder Interconnection Specimen Design and Test Control Procedure for Valid Constitutive Modeling of Solder Alloys," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 31-June 1, 2006
· D. Bhate, G. Subbarayan, “A Nonlinear Fracture Mechanics Perspective on Solder Joint Fatigue: Going Beyond the Coffin-Manson Equation,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 31-June 1, 2006
· D. Bhate, M. Dunn, “Adhesion of Arbitrary Shaped Thin Film Microstructures”, EuroSimE, Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy, April 24-26, 2006
________________________________________________________________________________________________________________________________

HONORS AND ACTIVITIES
· Semiconductor Research Corporation (SRC) student (05/2004 – present)
· Natl. Science Foundation Fellowship to attend Summer Institute on Nano Mechanics and Materials (08/2006)
· National Talent Scholarship recipient, India (08/1995 – 07/2001)
· Founding member and chief organizer, Theoretical Mechanics at Purdue, a student-run special interest group at Purdue University, IN (08/2006 – present)