Symposium on Mechanics of Integrated Material Structures in Advanced and Emerging Technologies (IMECE 2009)

At the 2009 ASME International Mechanical Engineering Congress & Exposition (IMECE 2009)

November 13-19,  2009, Lake Buena Vista, Florida

Track 12: Mechanics of Solids, Structures and Fluids

Symposium on Mechanics of Integrated Material Structures in Advanced and Emerging Technologies

Deadline for abstract submission: March 2, 2009.

To submit your abstracts to this symposium, first select "Track 12 Mechanics of Solids, Structures and Fluids"; then select "Topic 12-17 Mechanics of Integrated Material Structures in Advanced and ...".

Description:

This symposium aims to offer a forum to foster discussions on the latest advances in the cross-disciplinary field of integrated structures, including but not limited to materials and structures in integrated circuits, micro/nano electromechanical systems, flexible and stretchable electronics, biological materials and structures, multifunctional materials, and energy systems. The objective is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced/emerging technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome.

A list of topics is as follows,

• Mechanics of materials in microelectronics
• Mechanics of flexible and stretchable electronics (co-sponsored with Electronics & Photonics Division)
• Mechanics and materials in MEMS/NEMS
• Mechanics of biological materials and structures
• Mechanics of soft and active materials
• Mechanics of multifunctional and smart materials (co-sponsored with Materials Division)
• Mechanics and materials in energy systems

This Symposium is organized by the Technical Committee of Integrated Structures (TCIS) of ASME Applied Mechanics Division. The committee members include: Wei Hong (Iowa State University), Thao Vicky Nguyen (Johns Hopkins University), Mauro J Kobrinsky (Intel Inc.), Xiaohu Liu (IBM), Xi Chen (Columbia University), Rui Huang (University of Texas at Austin), Hanqing Jiang (Arizona State University), Xiaodong Li (University of South Carolina),  Jun He (Intel, co-chair), and Teng Li (University of Maryland, co-chair).